Modular Optical Interconnect Assemblies for Backplane and Switching Applications

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9632981 Kostuk The increasing demands on interconnects for network switching and multiprocessor backplanes is forcing consideration of advanced electrical and nonelectrical solutions, such as optical interconnects. Electrical backplanes have been demonstrated at data rates of 500 MHz for 64 bit wide buses with point-to-point connections over distances of 0.5 m (i.e. Cray T-90). Optics can increase the performance of such systems by providing higher bandwidths over long transmission distances, and support architectures requiring fanout and fanin. Another important performance consideration is system cost. The Cray electrical backplane is expensive because it requires non-conventional electronic switching elements and packaging methods. If optics is to prove useful, the cost of its devices and packaging must be lower than electrical alternatives. Many research groups have concentrated on developing optical interconnect architectures and optoelectronic devices. However, micro optic interconnect systems and cost reducing fabrication methods are not very well developed. The purpose of this proposal is to advance the state of micro optic system development by implementing optical interconnect modules for two important interconnect applications: 1) backplane networks, and 2) multistage switching systems. Both systems utilize free-space micro diffractive optic components to increase routing functionality over short connection distances while maintaining acceptable alignment tolerances. The free-space optics module for the backplane application provides an efficient parallel interface between vertical cavity surface emitting laser (VCSEL) arrays and a long distance fiber distribution network. This allows the backplane to extend from the intra machine to inter machine levels for parallel processing tasks. The optics modules for multistage switching systems are suitable for interfacing to both VCSEL and CMOS-SEED modulator smart pixel array systems. The proposed free-space op tics modules reduce the complexity of earlier optical system designs by eliminating the requirement for polarization optics and increases the optical transfer efficiency. This should increase the bandwidth at which these systems can operate. In addition to designing and fabricating these optical interface modules we are planning to work with Donnelly Corporation to apply their injection molding techniques to replicate the optical components and packaging mounts. This should further reduce the cost of implementing these systems. A collaboration with the University of Colorado is also planned to incorporate our optics module for the multistage switching system in their intelligent backplane architecture. ***