Modular Optical Interconnect Assemblies for Backplane and Switching Applications

用于背板和交换应用的模块化光学互连组件

• 批准号: 9632981
• 负责人: Raymond Kostuk
• 金额: $ 22.35万
• 依托单位: University of Arizona
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1996
• 资助国家: 美国
• 起止时间: 1996-08-01 至 2000-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9632981&HistoricalAwards=false
• 关键词: Modular; Optical; Interconnect; Assemblies; Backplane

9632981 Kostuk The increasing demands on interconnects for network switching and multiprocessor backplanes is forcing consideration of advanced electrical and nonelectrical solutions, such as optical interconnects. Electrical backplanes have been demonstrated at data rates of 500 MHz for 64 bit wide buses with point-to-point connections over distances of 0.5 m (i.e. Cray T-90). Optics can increase the performance of such systems by providing higher bandwidths over long transmission distances, and support architectures requiring fanout and fanin. Another important performance consideration is system cost. The Cray electrical backplane is expensive because it requires non-conventional electronic switching elements and packaging methods. If optics is to prove useful, the cost of its devices and packaging must be lower than electrical alternatives. Many research groups have concentrated on developing optical interconnect architectures and optoelectronic devices. However, micro optic interconnect systems and cost reducing fabrication methods are not very well developed. The purpose of this proposal is to advance the state of micro optic system development by implementing optical interconnect modules for two important interconnect applications: 1) backplane networks, and 2) multistage switching systems. Both systems utilize free-space micro diffractive optic components to increase routing functionality over short connection distances while maintaining acceptable alignment tolerances. The free-space optics module for the backplane application provides an efficient parallel interface between vertical cavity surface emitting laser (VCSEL) arrays and a long distance fiber distribution network. This allows the backplane to extend from the intra machine to inter machine levels for parallel processing tasks. The optics modules for multistage switching systems are suitable for interfacing to both VCSEL and CMOS-SEED modulator smart pixel array systems. The proposed free-space op tics modules reduce the complexity of earlier optical system designs by eliminating the requirement for polarization optics and increases the optical transfer efficiency. This should increase the bandwidth at which these systems can operate. In addition to designing and fabricating these optical interface modules we are planning to work with Donnelly Corporation to apply their injection molding techniques to replicate the optical components and packaging mounts. This should further reduce the cost of implementing these systems. A collaboration with the University of Colorado is also planned to incorporate our optics module for the multistage switching system in their intelligent backplane architecture. ***

网络交换和多处理器背板对互连的需求日益增长，迫使人们考虑先进的电气和非电气解决方案，如光互连。电气背板已在数据速率为500 MHz的64位宽总线上进行了演示，其点对点连接距离为0.5 m（即Cray T-90）。光学可以通过在长距离传输中提供更高的带宽来提高此类系统的性能，并支持需要fanout和fanin的架构。另一个重要的性能考虑因素是系统成本。Cray电背板价格昂贵，因为它需要非传统的电子开关元件和封装方法。如果光学被证明是有用的，它的设备和包装的成本必须低于电子替代品。许多研究小组专注于光互连架构和光电子器件的开发。然而，微光互连系统和降低成本的制造方法还没有得到很好的发展。本提案的目的是通过为两个重要的互连应用：1)背板网络和2)多级交换系统实现光互连模块来推进微光系统的发展状态。这两个系统都利用自由空间微衍射光学元件来增加短连接距离的路由功能，同时保持可接受的校准公差。用于背板应用的自由空间光学模块在垂直腔面发射激光器（VCSEL）阵列和长距离光纤分配网络之间提供了一个有效的并行接口。这允许背板从机器内部扩展到机器间级别，以并行处理任务。多级交换系统的光学模块适用于VCSEL和CMOS-SEED调制器智能像素阵列系统的接口。所提出的自由空间光学模块通过消除对偏振光学器件的要求，降低了早期光学系统设计的复杂性，并提高了光传输效率。这将增加这些系统可以运行的带宽。除了设计和制造这些光接口模块外，我们还计划与Donnelly公司合作，应用他们的注塑技术来复制光学组件和封装支架。这将进一步降低实施这些系统的成本。我们还计划与科罗拉多大学合作，将我们用于多级交换系统的光学模块整合到他们的智能背板架构中。＊＊＊