Undergraduate Electronic Packaging and Materials Laboratory

随着电子元件尺寸的缩小和功能复杂性的增加，封装成为一个非常重要的问题。电子封装对电气、热、机械和材料的要求使其成为学术界和工业界高度交叉的学科。这是美国工业必须在全球经济中保持竞争力的一项关键技术。为了向本科生提供技术培训，该系正在建立一个跨学科的电子封装与材料实验室(EPM Lab)。这些课程和实验室是高度跨学科的。该项目不仅涵盖电气工程的几个子领域，即电路和系统、微波工程、可靠性和测试、测量和计算技术，而且还包括封装和材料的热和机械分析。该课程旨在培养能够整合不同工程学科技术的新一代工程师，并使他们能够为美国在EPM领域的经济竞争力做出贡献，特别是为快速增长的地区性EPM行业做出贡献。该实验室可设在将于1996年秋季完工的新的电气工程/计算机科学和工程大楼内。

As electronic components decrease in size and increase in functional complexity, packaging becomes a very important issue. The requirements of electrical, thermal, mechanical, and material considerations in electronic packaging make it a highly interdisciplinary subject, in both academia and industry. This is one key technology in which U.S. industry must maintain its competitiveness in the global economy. To provide technical training to undergraduate students, this department is establishing an interdisciplinary Electronic Packaging and Materials Laboratory (EPM Lab). The courses and laboratory are highly interdisciplinary. The project covers not only several subareas in electrical engineering, namely circuits and systems, microwave engineering, reliability and testing, and measurement and computational techniques, but also thermal and mechanical analyses of packaging and materials. This curriculum is training a new breed of engineers that are capable of integrating technologies from various engineering disciplines and enabling them to contribute to U.S. economic competitiveness in the area of EPM, particularly to the rapidly growing regional EPM industry. The laboratory can be housed in the new Electrical Engineering/Computer Science and Engineering Building to be completed in the fall of 1996.