Undergraduate Electronic Packaging and Materials Laboratory

本科生电子封装与材料实验室

• 批准号: 9650978
• 负责人: Yasuo Kuga
• 金额: $ 4.16万
• 依托单位: University of Washington
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1996
• 资助国家: 美国
• 起止时间: 1996-09-01 至 1998-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9650978&HistoricalAwards=false
• 关键词: Undergraduate; Electronic; Packaging; Materials; Laboratory

As electronic components decrease in size and increase in functional complexity, packaging becomes a very important issue. The requirements of electrical, thermal, mechanical, and material considerations in electronic packaging make it a highly interdisciplinary subject, in both academia and industry. This is one key technology in which U.S. industry must maintain its competitiveness in the global economy. To provide technical training to undergraduate students, this department is establishing an interdisciplinary Electronic Packaging and Materials Laboratory (EPM Lab). The courses and laboratory are highly interdisciplinary. The project covers not only several subareas in electrical engineering, namely circuits and systems, microwave engineering, reliability and testing, and measurement and computational techniques, but also thermal and mechanical analyses of packaging and materials. This curriculum is training a new breed of engineers that are capable of integrating technologies from various engineering disciplines and enabling them to contribute to U.S. economic competitiveness in the area of EPM, particularly to the rapidly growing regional EPM industry. The laboratory can be housed in the new Electrical Engineering/Computer Science and Engineering Building to be completed in the fall of 1996.

随着电子元件尺寸的减小和功能复杂性的增加，封装成为一个非常重要的问题。电子封装中的电气，热，机械和材料考虑的要求使其成为学术界和工业界的一个高度交叉学科。这是美国工业必须在全球经济中保持竞争力的关键技术之一。为了向本科生提供技术培训，该部门正在建立一个跨学科的电子封装和材料实验室。 课程和实验室是高度跨学科的。该项目不仅涵盖电气工程的几个子领域，即电路和系统、微波工程、可靠性和测试以及测量和计算技术，而且还涵盖包装和材料的热和机械分析。该课程正在培养一批新的工程师，他们能够整合来自不同工程学科的技术，并使他们能够为美国经济竞争力做出贡献。该实验室可设在新的电气工程/计算机科学和工程大楼，将于1996年秋季完工。