Postdoc: ECS Postdoctoral Associate: Design and Simulation of Algorithms and Mechanisms for Precision Assembly

博士后：ECS 博士后：精密装配算法和机制的设计与仿真

• 批准号: 9705022
• 负责人: Ken Goldberg
• 金额: $ 4.61万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-09-01 至 1999-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9705022&HistoricalAwards=false
• 关键词: Postdoc; ECS; Postdoctoral; Associate; Design

9705022 Goldberg, Kenneth Y. University of California - Berkeley CISE Postdoctoral Research Associates in Experimental CS: Design and Simulation of Algorithms and Mechanisms for Precision Assembly (This award supports CES associate Karl Bohringer.) Progress in miniaturization of mass-produced commercial products requires improvements and innovation in precision assembly. Products such as magnetic storage systems, palmtop and wearable computers, or telecommunications devices often require submicron-level assembly operations. Increasingly, the components for such assemblies are batch-fabricated in MEMS (micro electro mechanical system) technology, often yielding thousands of components in one parallel fabrication run. In contrast to the highly automated fabrication of MEMS components, current assembly techniques are rather limited. Conventional, sequential pick-and-place assembly is extremely inefficient or impractical for such applications, because of the small size of the components and the high accuracy required. Instead, novel techniques are proposed for parallel self-assembly. Active surfaces (i.e., surfaces that can generate two-dimensional force vector fields) permit the precise positioning, orienting, and sorting of small parts with little or no sensor feedback. Vibration and fluidic agitation can generate a motive force for parallel assembly. Mechanical compliance, using micro-chamfers and latches, can be exploited to reduce the degrees of freedom of the components. Detailed models are developed to describe precision parallel assembly using three techniques: mechanical vibration, fluidic agitation, and active surfaces. The motive force response for each of these techniques is analyzed, and simulations with a modeling system are performed. Physical experiments are performed to confirm that our models accurately reflect measured behavior.

9705022 Goldberg，Kenneth Y. 加州伯克利大学 CISE博士后研究助理在实验CS：设计和模拟的算法和机制，精密装配 (This该奖项支持CES助理Karl Bohringer。 大规模生产的商业产品的小型化的进步需要在精密组装方面的改进和创新。 诸如磁存储系统、掌上电脑和可穿戴计算机或电信设备等产品通常需要亚微米级的组装操作。 越来越多地，用于这种组件的部件在MEMS（微机电系统）技术中批量制造，通常在一个并行制造运行中产生数千个部件。 与MEMS部件的高度自动化制造相比，当前的组装技术相当有限。 传统的顺序拾取和放置组装对于这样的应用是非常低效或不切实际的，因为部件的尺寸小并且所需的精度高。 相反，新的技术提出了并行自组装。 有源表面（即，可以产生二维力矢量场的表面）允许在很少或没有传感器反馈的情况下对小部件进行精确定位、定向和分类。 振动和流体 搅拌可以产生用于平行组装的原动力。 使用微倒角和闩锁的机械顺应性可用于减少部件的自由度。 详细的模型来描述精密并联装配使用三种技术：机械振动，流体搅拌，和主动表面。 分析了每种技术的动力响应，并使用建模系统进行了模拟。 进行物理实验 以确认我们的模型准确地反映了测量行为。