Challenges in CISE: Planning and Control for Massively Parallel Manipulation

9726389加州大学伯克利分校肯尼斯·戈德堡在CEISE中的挑战：大规模并行操作的计划和控制增加了磁盘驱动器、显示器和传感器等大规模生产产品的小型化，需要在设计和部件处理方面进行根本性创新。这些产品中的许多组件将是集成电路和采用大规模平行晶片刻蚀技术制造的MEMS(微型电子机械系统)。传统的拾取和贴装机器人技术不足以有效地组装这些微米级的部件。这项提议提出了一种基于无传感器和极简主义机器人学最新见解的全新方法：大规模并行操作。这个想法是利用平面力和力矩来移动零件，这些力和力矩需要最少的传感和伺服。由每个点上的力的大小和方向定义的场的形状可以被设计成并行地定位、对准、分类和组装小部件阵列。平面力场在小型零件的精密并联装配方面有着巨大的潜力。这项研究的目标是开发一种全新的精密零件操纵方法，并用新的理论、算法和高性能设备进行演示。这项研究有可能使新一代消费品和工业产品的制造并行化。

9726389 Goldberg, Kenneth University of California-Berkeley Challenges in CISE: Planning and Control for Massively Parallel Manipulation Increased miniaturization of mass-produced products such as disk drives, displays, and sensors requires fundamental innovations in design and parts handling. Many of the components in these products will be integrated circuits and MEMS (Micro Electro Mechanical Systems) fabricated with massively parallel wafer etching technology. Conventional pick and place robotic techniques are inadequate for the efficient assembly of these micron-scale components. This proposal addresses an entirely new methodology founded on recent insights from sensorless and minimalist robotics: massively parallel manipulation. The idea is to move parts using planar forces and moments that require a minimum of sensing and servoing. The shape of the field, as defined by the magnitude and direction of the force at each point, can be designed to position, align, sort, and assemble arrays of small parts in parallel. Planar force fields have enormous potential for precise parallel assembly of small parts. The goal of the research is to develop an entirely new methodology for precision part manipulation and to demonstrate it with new theory, algorithms, and high-performance devices. This research has the potential to parallelize the manufacture of a new generation of consumer and industrial products.