Development of Virtual Reality Tools for Engineering Education
Development of Virtual Reality Tools for Engineering Education
批准号:
9975680
负责人:
Donald Brenner
金额:
$8.0万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
1999
资助国家:
美国
项目状态:
已结题
起止时间:
1999-08-15 至 2003-08-31
中文摘要
9975680 brenner北卡罗莱纳州立大学的这个项目继续开发用于工程教育的虚拟现实(VR)工具,使学生能够与教育计算机模型进行触觉和视觉交互。每个虚拟现实工作站的硬件由力反馈触觉和基于pc的可视化组成。触觉本质上是一个三维手持操纵杆,其中机械连杆用于控制触觉臂的运动。这种控制可以是推或拉的形式,也可以是对运动的阻力。在第一期资助期内,开发了包括原子间力、应力应变、扩散和气相沉积表面动力学在内的五个教育软件模块。在继续阶段,这些模块将被改进以消除颤振并包括立体可视化功能,并且将开发新的模块,说明与材料机械性能(蠕变,疲劳)相关的原子概念,以及围绕原子力显微镜图像构建的模块。同时触觉和视觉交互设计模块,以说明材料工程的概念,让学生获得“动手”的经验,否则看似抽象的主题,如原子间作用力和扩散障碍。事实证明,这种能力对于与实际应用而非抽象概念相关的工程专业学生尤为重要。参与这个项目的学生已经编写了一些模块来说明利用这个硬件的原子间键合、应力-应变行为和扩散过程。
英文摘要
9975680BrennerThis project at North Carolina State University continues development of virtual reality (VR) tools for engineering education that allow students to interact tactily and visually with an educational computer model. The hardware for each VR station is composed of a force-feedback haptic and PC-based visualization. The haptic is essentially a three-dimensional hand-held joystick in which mechanical linkages are used to control the motion of the haptic arm. This control can be in the form of a push or pull, or a resistance to motion. During the first funding period, five education software modules that include interatomic forces, stress-strain, diffusion and surface dynamics of vapor deposition have been developed. In the continuation phase, these modules will be refined to eliminate chatter and to include stereo visualization capabilities, and new modules illustrating atomistic concepts related to mechanical properties of materials (creep, fatigue) and modules built around atomic-force microscopy images will be developed.Simultaneous tactile and visual interaction with modules designed to illustrate concepts in materials engineering allows students to gain "hands-on" experience with otherwise seemingly abstract topics such as interatomic forces and diffusion barriers. This capability has proven especially important for engineering students that relate to practical applications rather than abstract concepts. Students working on this project have written modules illustrating interatomic bonding, stress-strain behavior, and diffusion processes that take advantage of this hardware.
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