Integration of Ultrasonic and Microelectromechanical Devices with Low-Power-CMOS Electronics for Volumetric Acoustic Imaging

超声波和微机电器件与低功耗 CMOS 电子器件的集成，用于体积声学成像

• 批准号: 9980875
• 负责人: Elliott Brown
• 金额: $ 52万
• 依托单位: University of California-Los Angeles
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-10-01 至 2003-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9980875&HistoricalAwards=false
• 关键词: Integration; Ultrasonic; Microelectromechanical; Devices; Low

Surface micro-electromechanical technology will be scaled to deep ultrasonic frequencies (~10-100 MHz) and integrated with ultra-low-power Si CMOS readout electronics to develop sub-centimeter sized, two-dimensional transmit/receive arrays that can be inserted in the mouth and coupled acoustically to individual teeth for the purpose of three-dimensional volumetric imaging. This project will extend the science of ultra-high-frequency acoustics and the technology of ultrasonic/electronic integration, consistent with the objectives of the 'XYZ-on-a-Chip' Program. It will take advantage of the low-power digital signal processing and image processing technologies currently being developed in other fields (e.g., wireless communications). Finally, it will enable a revolutionary, non-ionizing capability in dental imaging that promises to detect many important effects that conventional radiography usually miss (e.g., micro-cracks in teeth and carious lesions under existing restorations), and eliminate the environmental problems associated with medical radiography.

表面微型机电技术将被扩展到深度超声波频率(~10-100 MHz)，并与超低功耗硅CMOS读出电子设备相集成，以开发亚厘米大小的二维发射/接收阵列，这些阵列可以插入口腔并以声学方式耦合到个别牙齿，以实现三维体积成像。该项目将扩展超高频声学和超声/电子集成技术，与XYZ-on-a-Chip计划的目标一致。它将利用目前在其他领域(如无线通信)开发的低功率数字信号处理和图像处理技术。最后，它将在牙齿成像中实现革命性的非电离能力，有望检测出传统放射成像通常忽略的许多重要效果(例如，现有修复体下的牙齿微裂缝和龋齿病变)，并消除与医疗放射成像相关的环境问题。