SBIR Phase II: Micromachined Vacuum Microelectronic Devices Using Nanoscale Self-Assembly

SBIR 第二阶段：利用纳米级自组装的微机械真空微电子器件

• 批准号: 9983511
• 负责人: Dmitri Routkevitch
• 金额: $ 40万
• 依托单位: Nanomaterials Research LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-06-01 至 2002-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9983511&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Micromachined; Vacuum

This Small Business Innovation Research (SBIR) Phase II project will develop a novel low-cost microfabrication technology for vacuum microelectronics. Affordable and reliable microfabrication of refractory materials is needed, since these materials are able to withstand high temperature and severe electromagnetic radiation. Although several materials have been identified as candidates, they have both high cost and difficulties with high aspect ratio, high resolution bulk micromachining. An approach based on self-organized nanoporous anodic alumina with unique anisotropy morphology will allow high aspect ratio, high resolution micromachining. Phase I demonstrated that a vacuum microtriode with promising performance could be fabricated from micromachined alumina ceramic. This may be the only technology for making ceramic micro-electromechanical systems (MEMS) for vacuum microelectronics and other applications, that are stable in harsh environments, have mechanical durability, are compatible with mainstream microfabrication, cost less, and scale up suitably. Phase II will optimize the technology and design, fabricate prototypes of vacuum integrated circuits (logic and amplifier), and scale-up the processes of device batch production for evaluation.Potential commercial applications include vacuum microelectronics and MEMS for the harsh environments of space, satelliate communicaitons, radars, deep drilling, nuclear reactors, as well as less strenuous environments that attend such uses as cellular phone networks, flat panel displays, and various sensors

这个小型企业创新研究(SBIR)第二阶段项目将为真空微电子开发一种新的低成本微制造技术。由于耐火材料能够承受高温和严重的电磁辐射，因此需要负担得起和可靠的微细加工。虽然已有几种材料被确定为候选材料，但它们在大深宽比、高分辨率体微加工方面存在成本高和难度大的问题。一种基于具有独特各向异性形貌的自组织纳米孔阳极氧化铝的方法将可以实现高深宽比、高分辨率的微加工。阶段I表明，利用微机械氧化铝陶瓷可以制作出性能良好的真空微三极管。这可能是制造真空微电子和其他应用的陶瓷微电子机械系统(MEMS)的唯一技术，这些系统在恶劣的环境中稳定，具有机械耐用性，与主流微制造兼容，成本较低，并适当扩大规模。第二阶段将优化技术和设计，制造真空集成电路(逻辑和放大器)的原型，并扩大器件批量生产的工艺以供评估。潜在的商业应用包括真空微电子和MEMS，用于恶劣的空间环境、卫星通信、雷达、深孔钻探、核反应堆，以及不那么艰苦的环境，如蜂窝电话网络、平板显示器和各种传感器