Effect of Interface Strength on the Solder Joint Reliability of Flip Chip Packages

界面强度对倒装芯片封装焊点可靠性的影响

• 批准号: 0002986
• 负责人: Hassan Mahfuz
• 金额: $ 5万
• 依托单位: Tuskegee University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-08-01 至 2001-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0002986&HistoricalAwards=false
• 关键词: Effect; Interface; Strength; Solder; Joint

EEC-0002986MahfuzThe PI's proposed to apply both the finite element and experimental methods to study the effect of underfill/die or underfill/substrate adhesion on the solder joint reliability of flip chip packages. This work will be a collaborative effort between researchers at the Tuskegee University Center for Advanced Materials and Auburn University Center for Advanced Vehicle Electronics. For the finite element methods, two conditions, namely, strongly-bonded and weakly-bonded interfaces will be considered. The weakly-bonded interface will be modeled using a set of gap elements at the interface. For modeling the strong interface, a common set of nodes will be employed at the interface which will be shared by both the constituent materials. Results for the die stresses at the underfill interfaces will be correlated with the test chip sensor measurements. Also, the cycles to failure of the solder joints will be predicted using finite element method due to cyclic thermal loads.

EEC-0002986Mahfuz等人建议采用有限元和实验相结合的方法来研究底部填充/芯片或底部填充/基板粘接对倒装芯片封装焊点可靠性的影响。这项工作将是塔斯基吉大学先进材料中心和奥本大学先进车辆电子中心的研究人员共同努力的结果。对于有限元方法，将考虑两种情况，即强结合界面和弱结合界面。弱结合界面将使用界面处的一组间隙单元来模拟。为了对强界面进行建模，将在界面处使用一组公共节点，这将由两种组成材料共享。底部填充界面处芯片应力的结果将与测试芯片传感器的测量结果相关联。此外，还将使用有限元方法预测由于循环热载荷而导致焊点失效的循环次数。