Effect of Interface Strength on the Solder Joint Reliability of Flip Chip Packages

EEC-0002986 Mahfuz PI建议应用有限元和实验方法来研究倒装芯片封装的焊点可靠性上的焊料/管芯或焊料/衬底粘附的影响。 这项工作将是塔斯基吉大学先进材料中心和奥本大学先进汽车电子中心的研究人员之间的合作努力。 对于有限元方法，将考虑两种情况，即强粘结和弱粘结界面。 弱结合界面将使用界面处的一组间隙元素来建模。 为了对强界面进行建模，将在界面处采用一组公共节点，这组节点将由两种组成材料共享。 将测试芯片传感器的测量结果与芯片界面处的芯片应力结果相关联。 此外，由于循环热负荷，焊点的失效周期将使用有限元方法进行预测。

EEC-0002986MahfuzThe PI's proposed to apply both the finite element and experimental methods to study the effect of underfill/die or underfill/substrate adhesion on the solder joint reliability of flip chip packages. This work will be a collaborative effort between researchers at the Tuskegee University Center for Advanced Materials and Auburn University Center for Advanced Vehicle Electronics. For the finite element methods, two conditions, namely, strongly-bonded and weakly-bonded interfaces will be considered. The weakly-bonded interface will be modeled using a set of gap elements at the interface. For modeling the strong interface, a common set of nodes will be employed at the interface which will be shared by both the constituent materials. Results for the die stresses at the underfill interfaces will be correlated with the test chip sensor measurements. Also, the cycles to failure of the solder joints will be predicted using finite element method due to cyclic thermal loads.