A Coupled Lattice-based Continuum Formulation for Stress and Electromigration-mediated Diffusion in Polycrystalline Solids

用于多晶固体中应力和电迁移介导扩散的耦合晶格连续体公式

• 批准号: 0075989
• 负责人: Krishnakumar Garikipati
• 金额: $ 21万
• 依托单位: Regents of the University of Michigan - Ann Arbor
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-08-01 至 2004-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0075989&HistoricalAwards=false
• 关键词: Coupled; Lattice; based; Continuum; Formulation

0075989The research aims at developing a continuum formulation reflecting the coupling between composition and mechanics in polycrystalline solids. Electromigration effects are also included. The motivation is to model the evolution of microstructure, which can lead to failure of metal lines in integrated circuits. Composition, mechanics and electric fields interact via lattice-level mechanisms in a thermodynamic formulation from which the coupled field relations are derived. General initial and boundary value problems reflecting the complexity of phenomena such as diffusion creep, hillock formation, grain boundary motion, void formation and evolution can then be posed. The project will also develop computational methodologies to solve the resulting system of coupled partial differential equations.

这项研究旨在开发一种反映多晶固体中组成和力学之间的耦合的连续统公式。电迁移效应也包括在内。其动机是模拟微结构的演变，这可能导致集成电路中的金属线失效。在一个热力学公式中，组成、力学和电场通过晶格能级机制相互作用，并由此导出了耦合场关系。然后，可以提出反映诸如扩散蠕变、丘状形成、晶界运动、空洞形成和演化等现象的复杂性的一般初值和边值问题。该项目还将开发计算方法，以求解由此产生的耦合偏微分方程组。