CAREER: Development of Millimeter-Wave Polymer-Based Multi-layer Integration: Organic Micromachining Techniques

职业：基于毫米波聚合物的多层集成的发展：有机微加工技术

• 批准号: 0093525
• 负责人: Anh-Vu Pham
• 金额: $ 37.5万
• 依托单位: Clemson University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-08-15 至 2003-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0093525&HistoricalAwards=false
• 关键词: CAREER; Development; Millimeter; Wave; Polymer

0093525PhamThe next generation of electronic integration will require a technology that can combine solid-state integrated circuits (IC), functional microelectromechanical devices (MEMS), passive components, and sensors into a package. The demand for this multiple device integration poses substantial challenges at microwave and millimeter wave frequencies. Furthermore, a major factor that must be addressed for millimeter wave applications is the development of integration techniques to miniaturize electronic components.The author proposes to develop an organic micromachining technique which provides revolutionary concepts to address the need for future millimeter wave integration (28-40 GHz). The organic micromachining technology will provide a platform for integrating solid-state ICs, functional MEMS devices, passive components, and sensors into a system on a package. The compatibility of this technology with multilayer polymer thin-films is key to integrate ultra-light weight, small size and portable components. The major tasks of the proposed research include (1) Development of micromachined, 3-dimensional (3-D), polymer-based transmission lines to achieve ultralow loss, (2) Development of micromachined vertical interconnects to transport signals in 3-D multi-layer structures, and (3) Integration of multiple device technologies into the organic micromachining platform to develop future communication systems at millimeter wave frequencies. This integration scheme represents a packaging paradigm known as a system-on-a-package (SOP). The proposed tasks involve collaborative efforts with industry and national research centers including General Electric (GE CRD), Agilent Technologies, the National Science Foundation (NSF) Center for Advanced Engineering Fibers and Films at Clemson University, and the NSF Packaging Research Center at Georgia Tech. These collaborative efforts provide infrastructure and skills to study multiple aspects of the organic micromachining technology.The results of this research will lead to innovations and fundamental understanding of the next generation micromachining technology developed in a multilayer organic platform. Based on this effort, significant impact is expected upon the development of future communication systems by providing a means to combine unique functionalities of heterogeneous components. These systems will be able to sense, compute, and communicate through a wireless sensor network. Furthermore, this organic micromachining system, which is processed with conventional spin-coating and optical lithography to achieve high resolution and high aspect ratio, can be applied to the development of functional MEMS devices (switches, resonators, and tunable filters) and their integration with conventional solid-state ICs.The PI's teaching plan addresses the education from grade school to graduate studies. He has begun and will continue to develop a research program to assist students in transitioning from high school to college and from college to graduate studies. He would like to extend the opportunity to the disabled and under represented students who may have been traditionally left out of college and graduate studies. He has strong interests in developing R-F/Wireless design and laboratory courses integrating into the department's on-going wireless program at Clemson University. He will incorporate a web-based technology to broadcast interactive laboratory experiments to outreach high school students and college freshmen.

下一代电子集成将需要一种能够将固态集成电路（IC）、功能微机电器件（MEMS）、无源元件和传感器集成到一个封装中的技术。对这种多器件集成的需求在微波和毫米波频率上提出了重大挑战。此外，毫米波应用必须解决的一个主要因素是集成技术的发展，以使电子元件小型化。作者建议开发一种有机微加工技术，为解决未来毫米波集成（28-40 GHz）的需求提供革命性的概念。有机微加工技术将提供一个平台，将固态集成电路、功能性MEMS器件、无源元件和传感器集成到一个封装系统中。该技术与多层聚合物薄膜的兼容性是集成超轻重量、小尺寸和便携式组件的关键。该研究的主要任务包括：(1)开发基于聚合物的微机械三维传输线，以实现超低损耗；(2)开发微机械垂直互连，以传输三维多层结构的信号；(3)将多种器件技术集成到有机微加工平台中，以开发未来毫米波频率的通信系统。这种集成方案表示一种打包范例，称为包上系统（SOP）。拟议的任务涉及与行业和国家研究中心的合作，包括通用电气（GE CRD）、安捷伦技术、克莱姆森大学的国家科学基金会（NSF）高级工程纤维和薄膜中心，以及乔治亚理工学院的NSF包装研究中心。这些合作努力为研究有机微加工技术的多个方面提供了基础设施和技能。这项研究的结果将导致在多层有机平台上开发的下一代微加工技术的创新和基本理解。基于这一努力，通过提供一种方法来组合异构组件的独特功能，预计将对未来通信系统的开发产生重大影响。这些系统将能够通过无线传感器网络进行感知、计算和通信。此外，该有机微加工系统采用传统的自旋镀膜和光学光刻技术加工，可实现高分辨率和高纵横比，可应用于功能MEMS器件（开关、谐振器和可调谐滤波器）的开发及其与传统固态集成电路的集成。PI的教学计划涉及从小学到研究生的教育。他已经开始并将继续发展一项研究计划，以帮助学生从高中过渡到大学，从大学到研究生学习。他希望将机会扩大到残疾人和代表性不足的学生，这些学生可能传统上被排除在大学和研究生学习之外。他对开发R-F/无线设计和实验室课程有浓厚的兴趣，并将其整合到克莱姆森大学正在进行的无线项目中。他将结合一种基于网络的技术，向广大高中生和大学新生播放互动实验室实验。