CAREER: A Mixed Mesh and Hybrid Integral Equation Approach for Electromagnetic Simulation of Microwave Circuit

[0093692]随着毫米波/微波电路集成密度的提高，电路元件和器件之间的电磁相互作用成为影响信号完整性和系统电磁兼容性的重要因素。越来越多的人需要能够准确有效地预测和分析相互作用的数值方法，并最终为优化设计和原型设计提供手段，以满足性能和EMC要求。本课题提出了一种混合网格、混合积分方程的方法来精确、高效地模拟微波电路。该模型的独特之处在于采用混合三角形-四面体网格（或四边形-六面体网格）对几何图形进行离散化。这使得在复杂结构中金属表面和介电区域的共形和精确建模成为可能。用矩量法建立和求解了曲面和体积的混合积分方程。为了保证解的稳定性和误差可处理性，研究系统条件简化和收敛速度将是本文研究的重要组成部分。为了提高计算效率，将采用多层快速多极方法。它的成功实现将使全波微波电路仿真从电路板级发展到系统级。此外，由于许多物体本质上是由导体和电介质组成的，因此本研究开发的混合网格和混合积分方程方法也将适用于广泛的其他应用，如EMC/EMI模拟，材料涂层目标的雷达散射计算，以及预测射频设备与人体的电磁相互作用。通过建立虚拟实验实验室，让学生对各种电磁散射和辐射问题进行互动模拟，将研究与PI的学术教学活动相结合。教学活动旨在鼓励本科生参与工程设计和模拟，并将作为演示来吸引年轻人（他们是未来潜在的工程师）的兴趣。该项目的成功将为未来高速和微波印刷电路的CAD设计和原型设计提供一种新的独特工具。它也将为大学生探索和了解微波印刷结构的特性提供一个新的机会和独特的工具。

0093692LuWith the increase of the integration density of millimeter-wave/microwave circuits, electromagnetic interactions among circuit components and devices become important factors that affect the signal integrity and system electromagnetic compatibility (EMC). There are growing demands for numerical methods that will accurately and effectively predict and analyze the interactions, and eventually provide means for optimum design and prototyping to meet both performance and EMC requirements. This project proposes a mixed mesh, hybrid integral equation approach for the accurate and efficient simulation of microwave circuits. A unique feature of this new model is to use mixed triangle-tetrahedron mesh (or quadrangle-hexahedron mesh) to discretize the geometry. This allows the conformal and accurate modeling of both the metallic surface and the dielectric regions in a complex structure. The hybrid surface and volume integral equations are formulated and solved using the method of moments. The investigation of system condition reduction and convergence sped-up will be an important part of the proposed research in order to ensure stable and error tractable solution. The multilevel fast multipole method will be implemented to achieve computational efficiency. The successful implementation of it will bring the full-wave microwave circuit simulation to circuit board-level and eventually to system-level. Moreover, as many objects are essentially made up of conductors and dielectrics, the mixed mesh and hybrid integral equation approach developed from this research will also be suitable for a wide range of other applications such as EMC/EMI simulation, radar scattering calculation for material coated targets, and predicting the electromagnetic interaction of radio frequency devices and human bodies.The research will be integrated with the PI's academic teaching activities through the establishment of a virtual experiment lab for students to perform interactive simulation of various electromagnetic scattering and radiation problems. The teaching activities are designed to encourage the participation of undergraduate students in engineering design and simulation, and will be used as demos to attract the interest of young people (who are tomorrow's potential engineers). The success of this project will lead to a new and unique tool for future CAD design and prototyping of high-speed and microwave printed circuits. It will also provide a new opportunity and a unique tool for university students to explore and understand the characteristics of microwave printed structures.