2001 TSE: NSF/EPA Partnership for Environmental Research: Design for product-embedded disassembly using reversible integral attachments (TSE01-H)

2001 TSE：NSF/EPA 环境研究合作伙伴：使用可逆整体附件进行产品嵌入式拆卸设计 (TSE01-H)

• 批准号: 0124415
• 负责人: Kazuhiro Saitou
• 金额: --
• 依托单位: Regents of the University of Michigan - Ann Arbor
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-02-15 至 2007-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0124415&HistoricalAwards=false
• 关键词: 2001; TSE; NSF; EPA; Partnership

0124415 Saitou The goal of the proposed research is to develop a general method for designing products with embedded disassembly processes that can be invoked by "pressing a disassembly button". This will be achieved by developing a new class of reversible integral attachments (RIAs) that can be detached by the application of localized heat. Design methodologies will be developed that will facilitate: (1) the identification of the components to be recovered, and (2) the embedding of RIAs into the product to facilitate the most efficient access to the components of interest upon product disassembly. Specific research tasks include: (1) extension of existing approaches toward determining recovery targets to include environmental validation metrics with the intent of considering both environmental and financial factors during design for disassembly, (2) development of a design method for a new class of RIAs that can be detached by application of localized heat, based on the structural topology optimization algorithm, and (3) development of a systematic procedure to generate the design specifications (attachment location, engagement type, removal direction, heating spot location) for RIAs using computer aided design technology in order to realize the most efficient access to components, based on the overall product geometry and the desired disassembly sequence. ***

0124415斋藤-所提出的研究的目标是开发一种通用的方法，用于设计产品与嵌入式拆卸过程中，可以调用“按下拆卸按钮”。 这将通过开发一种新型的可逆的整体附件（RIA）来实现，这种附件可以通过局部加热来分离。 将开发设计方法，以便于：（1）识别待回收的部件，以及（2）将RIA嵌入产品，以便于在产品拆卸时最有效地获取感兴趣的部件。 具体研究任务包括：（1）扩展现有的确定回收目标的方法，以包括环境验证指标，目的是在拆卸设计期间考虑环境和财务因素，（2）基于结构拓扑优化算法，开发一种新的RIA类的设计方法，其可以通过应用局部热来拆卸，及（3）发展一套系统化的程序，以制订设计规格（连接位置、接合类型、移除方向、加热点位置），以实现对部件的最有效访问，基于整体产品几何形状和期望的拆卸顺序。 ***