2001 TSE: NSF/EPA Partnership for Environmental Research: Design for product-embedded disassembly using reversible integral attachments (TSE01-H)

2001 TSE：NSF/EPA 环境研究合作伙伴：使用可逆整体附件进行产品嵌入式拆卸设计 (TSE01-H)

• 批准号: 0124415
• 负责人: Kazuhiro Saitou
• 金额: --
• 依托单位: Regents of the University of Michigan - Ann Arbor
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-02-15 至 2007-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0124415&HistoricalAwards=false
• 关键词: 2001; TSE; NSF; EPA; Partnership

0124415 Saitou The goal of the proposed research is to develop a general method for designing products with embedded disassembly processes that can be invoked by "pressing a disassembly button". This will be achieved by developing a new class of reversible integral attachments (RIAs) that can be detached by the application of localized heat. Design methodologies will be developed that will facilitate: (1) the identification of the components to be recovered, and (2) the embedding of RIAs into the product to facilitate the most efficient access to the components of interest upon product disassembly. Specific research tasks include: (1) extension of existing approaches toward determining recovery targets to include environmental validation metrics with the intent of considering both environmental and financial factors during design for disassembly, (2) development of a design method for a new class of RIAs that can be detached by application of localized heat, based on the structural topology optimization algorithm, and (3) development of a systematic procedure to generate the design specifications (attachment location, engagement type, removal direction, heating spot location) for RIAs using computer aided design technology in order to realize the most efficient access to components, based on the overall product geometry and the desired disassembly sequence. ***

0124415 Saitou拟议研究的目标是开发一种通用方法，用于设计具有嵌入式拆卸过程的产品，该过程可以通过“按下拆卸按钮”来调用。这将通过开发一种新型的可逆积分附件(RIA)来实现，这种附件可以通过施加局部热来分离。将开发设计方法，以促进：(1)确定要回收的部件，以及(2)在产品中嵌入RIA，以便于在产品拆卸时最有效地获取感兴趣的部件。具体的研究任务包括：(1)扩展现有的确定回收目标的方法，以包括环境验证指标，目的是在拆卸设计期间考虑环境和财务因素；(2)基于结构拓扑优化算法，开发一种可通过施加局部热来拆卸的新型RIA的设计方法；以及(3)开发系统程序，利用计算机辅助设计技术生成RIA的设计规范(连接位置、接合类型、移除方向、加热点位置)，以便基于总体产品几何形状和所需的拆卸顺序实现对部件的最有效访问。***