On-Chip Bulk Assembly/Disassembly Method of Micro/Meso-Scale Discrete Components

本研究项目的目的是为开发一种新的微细观部件的组装/拆卸方法奠定基础。该项目将研究在平面基板上大量组装/拆卸微型到中尺度的分立部件，使用振动托盘进行总体定位，并结合基板上的微机械线性冲击致动器进行精细定位和正向紧固和释放。研究还旨在证明该方法作为一种承载芯片互连手段在多芯片模块(MCM)的组装和拆卸中的潜在有效性。振动托盘将被应用，以有效地消除顺序拾取式部件搬运/定位的需要。所施加的高频振动旨在克服部件、处理装置和基板之间的粘连。微机械线性冲击执行器也将通过外部振动选择性地激活，以提供精确的定位和组件的正向紧固和释放。将一系列码垛特征和线性冲击致动器集成在一个共同的基板上，旨在实现一种适合于微型机电应用的整体组装/拆卸方法。这项研究的成功完成将为适合自动化的微型/中尺度部件的批量组装和拆卸提供有利的知识。该方法将极大地增加可组合制造工艺和材料的数量，并通过增加子系统模块化来提高系统可靠性，从而推动当前的微电子和MEMS制造技术。

The objective of this research project is to develop the foundation for a novel assembly/disassembly method for micro/meso-scale components. The project will investigate bulk assembly/disassembly of micro- to meso-scale discrete components on a planar substrate using the combination of vibratory palletization for gross positioning and on-substrate micromechanical linear impact actuators for fine positioning and positive fastening and release. The research also aims to demonstrate the potential effectiveness of the method as a bear-chip interconnection means in multi-chip module (MCM) assembly and disassembly. Vibratory palletization will be applied to effectively eliminate the need of sequential pick-and-place style component handling/positioning. The applied high-frequency vibration is intended to overcome sticking among the components, handling devices, and substrates. The micromechanical linear impact actuators will be selectively activated also by external vibration, to provide fine positioning and positive fastening and release of the components. The integration of an array of palletizing features and linear impact actuators on a common substrate is intended to realize a bulk assembly/disassembly method suitable for micro electromechanical applications. Successful completion of the research will provide the enabling knowledge for bulk assembly and disassembly of micro/meso-scale components amenable for automation. The method will advance the current microelectrical and MEMS fabrication technology by dramatically increasing the number of combinable fabrication processes and materials and by improving the system reliability through increased subsystem modularity.