On-Chip Bulk Assembly/Disassembly Method of Micro/Meso-Scale Discrete Components

微细尺度分立元件的片上批量组装/拆卸方法

• 批准号: 9813110
• 负责人: Kazuhiro Saitou
• 金额: $ 23.94万
• 依托单位: Regents of the University of Michigan - Ann Arbor
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1998
• 资助国家: 美国
• 起止时间: 1998-09-01 至 2002-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9813110&HistoricalAwards=false
• 关键词: Chip; Bulk; Assembly; Disassembly; Method

The objective of this research project is to develop the foundation for a novel assembly/disassembly method for micro/meso-scale components. The project will investigate bulk assembly/disassembly of micro- to meso-scale discrete components on a planar substrate using the combination of vibratory palletization for gross positioning and on-substrate micromechanical linear impact actuators for fine positioning and positive fastening and release. The research also aims to demonstrate the potential effectiveness of the method as a bear-chip interconnection means in multi-chip module (MCM) assembly and disassembly. Vibratory palletization will be applied to effectively eliminate the need of sequential pick-and-place style component handling/positioning. The applied high-frequency vibration is intended to overcome sticking among the components, handling devices, and substrates. The micromechanical linear impact actuators will be selectively activated also by external vibration, to provide fine positioning and positive fastening and release of the components. The integration of an array of palletizing features and linear impact actuators on a common substrate is intended to realize a bulk assembly/disassembly method suitable for micro electromechanical applications. Successful completion of the research will provide the enabling knowledge for bulk assembly and disassembly of micro/meso-scale components amenable for automation. The method will advance the current microelectrical and MEMS fabrication technology by dramatically increasing the number of combinable fabrication processes and materials and by improving the system reliability through increased subsystem modularity.

本研究的目的是发展一种新的微/中尺度组件的装配/拆卸方法的基础。 该项目将研究在平面基板上批量组装/拆卸微型至中型分立元件，使用振动托盘进行粗定位，并使用基板上微机械线性冲击致动器进行精细定位以及正向紧固和释放。 研究还旨在证明该方法作为多芯片组件（MCM）组装和拆卸中的轴承-芯片互连手段的潜在有效性。 将采用振动贴装，以有效消除顺序拾取和放置式组件处理/定位的需要。 所施加的高频振动旨在克服部件、处理装置和基板之间的粘附。微机械线性冲击致动器也将通过外部振动选择性地激活，以提供部件的精确定位和可靠紧固和释放。 在一个共同的基板上的阵列的叠置功能和线性冲击致动器的集成是为了实现适合于微机电应用的批量组装/拆卸方法。 研究的成功完成将为适合自动化的微/中尺度组件的批量组装和拆卸提供使能知识。 该方法将通过显著增加可组合的制造工艺和材料的数量以及通过增加子系统模块化来提高系统可靠性来推进当前的微电子和MEMS制造技术。