REU Site: Research Opportunities for Undergraduates in the Field of Electronics Packaging

该奖项提供资金，以纽约州立大学宾厄姆顿分校的支持下，博士Bahgat G。萨玛基亚 这个为期十周的暑期课程将涉及通过集成电子工程中心（IEEC）在电子封装研究的多学科领域每年八名学生。学生将有机会与来自行业的科学家和工程师互动。 研究团队将包括本科生，教师，研究生和工业导师。 该项目将招收广泛的学生，包括妇女和代表性不足的少数民族，不仅来自宾厄姆顿，而且来自其他机构。 虽然独立研究将被强调，学生将有机会体验在团队环境中工作。 需要口头和书面交流研究结果。

This award provides funding to SUNY Binghamton for the support of a three-year, REU Site in Electronics Packaging, under the direction of Dr. Bahgat G. Sammakia. This ten-week summer program will involve eight students annually in the multidisciplinary field of electronics packaging research through the Integrated Electronics Engineering Center (IEEC). Students will have the opportunity to interact with scientists and engineers from industry. The research teams will include undergraduate students, faculty, graduate students, and industrial mentors. A broad mix of students, including women and under-represented minorities, not only from Binghamton but from other institutions as well, will be recruited for the program. While independent research will be stressed, students will have the opportunity to experience working in a team environment. Oral and written communication of research results will be required.