REU Site: Research Opportunities for Undergraduates in the Field of Electronics Packaging

REU 网站：电子封装领域本科生的研究机会

• 批准号: 0139183
• 负责人: Bahgat Sammakia
• 金额: $ 14.68万
• 依托单位: SUNY at Binghamton
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-06-01 至 2005-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0139183&HistoricalAwards=false
• 关键词: REU; Site; Research; Opportunities; Undergraduates

This award provides funding to SUNY Binghamton for the support of a three-year, REU Site in Electronics Packaging, under the direction of Dr. Bahgat G. Sammakia. This ten-week summer program will involve eight students annually in the multidisciplinary field of electronics packaging research through the Integrated Electronics Engineering Center (IEEC). Students will have the opportunity to interact with scientists and engineers from industry. The research teams will include undergraduate students, faculty, graduate students, and industrial mentors. A broad mix of students, including women and under-represented minorities, not only from Binghamton but from other institutions as well, will be recruited for the program. While independent research will be stressed, students will have the opportunity to experience working in a team environment. Oral and written communication of research results will be required.

该奖项向纽约州立大学宾厄姆顿分校提供资金，以支持在巴赫加特·G·萨马基亚博士的指导下，在电子包装领域建立一个为期三年的REU网站。这个为期十周的暑期项目每年将有八名学生通过集成电子工程中心(IEEC)在电子封装多学科领域进行研究。学生将有机会与工业界的科学家和工程师互动。研究团队将包括本科生、教职员工、研究生和行业导师。该项目将招收大量学生，包括女性和代表性不足的少数族裔，不仅来自宾厄姆顿，也来自其他机构。虽然将强调独立研究，但学生将有机会体验在团队环境中工作。研究结果的口头和书面交流将被要求。