State IUCRC for The Integrated Electronics Engineering Center Performing Research in Electronics Packaging

国家 IUCRC 代表集成电子工程中心进行电子封装研究

基本信息

项目摘要

The mission of the Integrated Electronics Engineering Center (IEEC) will be four-fold: (1) to support the integrated electronics industry of New York State with short-and long-range research and development and planning efforts, (2) to disseminate the results of research which will advance the leading edge of technology in the field, (3) to provide a technology transfer and training program to enhance economic development in New York State, and (4) to deliver a unique educational experience in integration of electronics design and assembly at the undergraduate and graduate level. The goals and objectives for IEEC can be classified into three areas of activities: (1) research and development, (2) collaborative activities with industry, other academic institutions and government agencies, and (3) economic development, including business start-up and work force productivity and stability enhancement. The organizational framework will include an Industrial Advisory Board (IAB) for formal liaisons with industry. Additionally, there will be a cadre of Project Liaisons from industry working directly with faculty researchers on each technical project. The IAB has representatives from IBM, GE, Universal Instruments, the State's University Industry Public Partnership for Economic Growth (UnIPEG), and the Watson School of Engineering. The purpose of the IAB is to provide a collaborative technical interaction between the Watson School and the Electronics packaging industry, by establishing broader industrial consensus on the most critical packaging topics, and by encouraging interdisciplinary activities among university researchers. Leading two-year academic institutions in the State will serve as transmitters for amplifying the technology transfer mechanism to other regions of the state. Research results will be disseminated by: (i) reporting initially to IEEC members via regularly scheduled Center briefing sessions, followed by, (ii) publications or presentations in public forums, followed by, (iii) training workshops open to any member of the public on a course fee basis. Additional courses will be offered at the undergraduate and graduate level beyond those already provided by the Watson School in electronics packaging. Aside from the transfer of research results directly to sponsors, there is the prospect of transfer in the longer term to other firms through the active involvement of faculty with state agencies, such as the University/Industry Public Partnership for Economic Growth (UnIPEG) and their Industrial Technical Extension Service (ITES). The Continuing Education Office of the Watson School will develop a number of short courses related to the Center's implementation retraining programs for the local microelectronics industry at the level of the individual employee, thereby improving productivity and/or employment stability. The State of New York, industry and NSF will provide matching funds totalling $750,000 in the first year.
集成电子工程中心(IEEC)的使命将有四个方面:(1)支持纽约州集成电子行业的短期和长期研发和规划工作,(2)传播将促进该领域尖端技术的研究成果,(3)提供技术转让和培训计划,以促进纽约州的经济发展;(4)在本科生和研究生水平提供独特的电子设计和组装一体化教育经验。IEEC的目标和目标可分为三个活动领域:(1)研究和开发,(2)与工业界、其他学术机构和政府机构的合作活动,以及(3)经济发展,包括企业启动和劳动力生产率和稳定性的提高。组织框架将包括一个工业咨询委员会(工业咨询委员会),负责与工业界进行正式联络。此外,将有一名来自行业的项目联络员干部直接与教师研究人员就每个技术项目进行合作。IAB的代表来自IBM、GE、环球仪器、州立大学工业公共经济增长伙伴关系(UnIPEG)和沃森工程学院。IAB的目的是通过在最关键的封装主题上建立更广泛的行业共识,并通过鼓励大学研究人员之间的跨学科活动,在沃森学院和电子封装行业之间提供协作的技术互动。该州领先的两年制学术机构将作为向该州其他地区扩大技术转让机制的传输者。研究成果将通过以下方式传播:(I)首先通过定期安排的中心简报会向IEEC成员报告,然后(Ii)在公共论坛上发布或介绍报告,(Iii)以课程费用的方式向任何公众开放培训讲习班。除了沃森学院已经提供的电子封装课程外,还将在本科生和研究生阶段提供额外的课程。除了将研究成果直接转让给赞助商外,从长远来看,还可以通过教师与国家机构的积极参与,如大学/工业公共经济增长伙伴关系(UnIPEG)及其工业技术推广服务(ITES),将研究成果转移给其他公司。华生学校的持续教育办公室将为当地微电子行业在员工个人层面开发一些与中心实施再培训计划相关的短期课程,从而提高生产率和/或就业稳定性。纽约州、工业和国家科学基金会将在第一年提供总计75万美元的配套资金。

项目成果

期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)

数据更新时间:{{ journalArticles.updateTime }}

{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

数据更新时间:{{ journalArticles.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ monograph.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ sciAawards.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ conferencePapers.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ patent.updateTime }}

Bahgat Sammakia其他文献

On the design of manifolds for parallel channel systems
  • DOI:
    10.1016/j.euromechflu.2024.07.004
  • 发表时间:
    2024-11-01
  • 期刊:
  • 影响因子:
  • 作者:
    Yaser Hadad;Ghazal Mohsenian;Paul Chiarot;Bahgat Sammakia
  • 通讯作者:
    Bahgat Sammakia
Sub-continuum thermal transport modeling using diffusion in the Lattice Boltzmann Transport Equation
  • DOI:
    10.1016/j.ijheatmasstransfer.2014.08.052
  • 发表时间:
    2014-12-01
  • 期刊:
  • 影响因子:
  • 作者:
    Cheng Chen;James Geer;Bahgat Sammakia
  • 通讯作者:
    Bahgat Sammakia
Early detection of <em>Candida albicans</em> biofilms at porous electrodes
  • DOI:
    10.1016/j.ab.2012.10.016
  • 发表时间:
    2013-02-15
  • 期刊:
  • 影响因子:
  • 作者:
    Robert B. Congdon;Alexander S. Feldberg;Natalie Ben-Yakar;Dennis McGee;Christopher Ober;Bahgat Sammakia;Omowunmi A. Sadik
  • 通讯作者:
    Omowunmi A. Sadik
Numerical investigation of inter-zonal boundary conditions for data center thermal analysis
  • DOI:
    10.1016/j.ijheatmasstransfer.2013.09.073
  • 发表时间:
    2014-01-01
  • 期刊:
  • 影响因子:
  • 作者:
    Zhihang Song;Bruce T. Murray;Bahgat Sammakia
  • 通讯作者:
    Bahgat Sammakia
Thermal challenges in heterogeneous packaging: Experimental and machine learning approaches to liquid cooling
  • DOI:
    10.1016/j.applthermaleng.2024.125081
  • 发表时间:
    2025-02-01
  • 期刊:
  • 影响因子:
  • 作者:
    Ahmad R Gharaibeh;Srikanth Rangarajan;Qusai Soud;Omar Al-Zubi;Yaman Manaserh;Bahgat Sammakia
  • 通讯作者:
    Bahgat Sammakia

Bahgat Sammakia的其他文献

{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

{{ truncateString('Bahgat Sammakia', 18)}}的其他基金

IUCRC Phase III Binghamton University: Center for Energy-Smart Electronic Systems (ES2)
IUCRC 第三期宾厄姆顿大学:能源智能电子系统中心 (ES2)
  • 批准号:
    2209776
  • 财政年份:
    2022
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Phase II IUCRC Binghamton University: Center for Energy-Smart Electronic Systems (ES2)
第二阶段 IUCRC 宾汉顿大学:能源智能电子系统中心 (ES2)
  • 批准号:
    1738793
  • 财政年份:
    2017
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Collaborative Center: I/UCRC in Center for Energy-Smart Electronic Systems (ES2)
合作中心:I/UCRC 能源智能电子系统中心 (ES2)
  • 批准号:
    1134867
  • 财政年份:
    2011
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
I/UCRC Planning Grant: I/UCRC for Energy Efficient Systems
I/UCRC 规划补助金:I/UCRC 节能系统
  • 批准号:
    1034739
  • 财政年份:
    2010
  • 资助金额:
    $ 224万
  • 项目类别:
    Standard Grant
REU Site: Research Opportunities for Undergraduates in the Field of Electronics Packaging
REU 网站:电子封装领域本科生的研究机会
  • 批准号:
    0139183
  • 财政年份:
    2002
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Small Firms Collaborative R&D Project with Rainbow Displays, Endicott, NY
小企业协作研发
  • 批准号:
    9815599
  • 财政年份:
    1999
  • 资助金额:
    $ 224万
  • 项目类别:
    Standard Grant

相似海外基金

IUCRC Phase I NJIT: Center for Integrated Material Science and Engineering of Pharmaceutical Products (CIMSEPP)
IUCRC 第一期 NJIT:医药产品综合材料科学与工程中心 (CIMSEPP)
  • 批准号:
    2137209
  • 财政年份:
    2022
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
IUCRC Phase I UMN: Center for Integrated Material Science and Engineering of Pharmaceutical Products (CIMSEPP)
IUCRC 第一期 UMN:医药产品综合材料科学与工程中心 (CIMSEPP)
  • 批准号:
    2137264
  • 财政年份:
    2022
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
IUCRC Phase 1 University of Central Florida: Center for Electronic-Photonic Integrated Circuits for Aerospace (EPICA)
IUCRC 第一阶段中佛罗里达大学:航空航天电子光子集成电路中心 (EPICA)
  • 批准号:
    2052701
  • 财政年份:
    2021
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
IUCRC Phase I Georgia Institute of Technology: Electronic-Photonic Integrated Circuits for Aerospace (EPICA)
IUCRC 第一阶段佐治亚理工学院:航空航天电子光子集成电路(EPICA)
  • 批准号:
    2052808
  • 财政年份:
    2021
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
IUCRC Phase I Vanderbilt University: Electronic-Photonic Integrated Circuits for Aerospace (EPICA)
IUCRC 第一阶段范德比尔特大学:航空航天电子光子集成电路 (EPICA)
  • 批准号:
    2052742
  • 财政年份:
    2021
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Phase II IUCRC at University of Virginia: Center for Multi-functional Integrated System Technology (MIST)
弗吉尼亚大学 IUCRC 第二阶段:多功能集成系统技术中心 (MIST)
  • 批准号:
    1939012
  • 财政年份:
    2020
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Phase II IUCRC at University of Central Florida: Center for Multi-functional Integrated System Technology
中佛罗里达大学 IUCRC 第二期:多功能集成系统技术中心
  • 批准号:
    1939050
  • 财政年份:
    2020
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Phase II IUCRC at University of Florida: Center for Multi-functional Integrated System Technology (MIST)
佛罗里达大学 IUCRC 第二期:多功能集成系统技术中心 (MIST)
  • 批准号:
    1939009
  • 财政年份:
    2020
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Phase II IUCRC at University of Illinois at Chicago: Center for Advanced Design and Manufacturing of Integrated Microfluidics (CADMIM)
伊利诺伊大学芝加哥分校的 II 期 IUCRC:集成微流体先进设计与制造中心 (CADMIM)
  • 批准号:
    1841473
  • 财政年份:
    2019
  • 资助金额:
    $ 224万
  • 项目类别:
    Continuing Grant
Planning IUCRC at Oklahoma State University: Center for Sustainably Integrated Buildings and Sites (SIBS)
俄克拉荷马州立大学 IUCCRC 规划:可持续综合建筑和场地中心 (SIBS)
  • 批准号:
    1841535
  • 财政年份:
    2019
  • 资助金额:
    $ 224万
  • 项目类别:
    Standard Grant
{{ showInfoDetail.title }}

作者:{{ showInfoDetail.author }}

知道了