SBIR Phase I: An Optical Sensor for Semiconductor Back-End Processes

SBIR 第一阶段：用于半导体后端工艺的光学传感器

• 批准号: 0213609
• 负责人: Jim Hang
• 金额: $ 10万
• 依托单位: New Dimension Research
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-07-01 至 2002-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0213609&HistoricalAwards=false
• 关键词: SBIR; Phase; Optical; Sensor; Semiconductor

This Small Business Innovation Research (SBIR) Phase I Project proposes to develop an innovative intelligent optical sensor for semiconductor back-end processes control and inspection by using our matrix-addressable laser/detector array chip. The sensor will be incorporated into the fine pitch component placement machines, to ensure accurate component placement, and co-planarity of component leads and to inspect components immediately before placement. Identification of defective or damage lead tips that lie within the same plane will be. Additional inspection capabilities include solder bump volume and height, bump position and quality, ball height and diameter of ball grit array, ball coplanarity and foreign materials. The sensor actually is a miniature confocal scanning laser microscope without any moving parts. Since there are no moving parts or bulky optics, we are able obtain image rate at least 60 frames per second, and sensor can be made a very small dimension. This sensor will enable semiconductor packaging manufactures to increase operating efficiency, increase product yield, and add to their quality control.

该小型企业创新研究（SBIR）第一阶段项目建议使用我们的矩阵可寻址激光/探测器阵列芯片开发一种创新的智能光学传感器，用于半导体后端工艺控制和检测。该传感器将被集成到细间距元件贴装机中，以确保准确的元件贴装和元件引线的共面性，并在贴装前立即检查元件。 位于同一平面内的缺陷或损坏引线尖端的识别将是。 其他检查功能包括焊料凸块体积和高度、凸块位置和质量、球高度和球磨粒阵列直径、球共面性和异物。该传感器实际上是一个微型共焦扫描激光显微镜，没有任何移动部件。由于没有移动部件或笨重的光学器件，我们能够获得至少每秒 60 帧的图像速率，并且传感器的尺寸可以做得非常小。该传感器将使半导体封装制造商能够提高运营效率、提高产品产量并加强质量控制。