SBIR Phase II: An Optical Sensor for Semiconductor Back-End Processes

该小型企业创新研究(SBIR)项目旨在利用半导体激光探测器阵列芯片，为半导体封装工艺开发创新的微型共焦激光扫描传感器。与其他共焦设备不同，该传感器中没有可供扫描的移动部件。这种成像速度快的传感器将与芯片IC贴片机器人集成在一起，在封装前对倒装芯片键合(FCB)和球栅阵列(BGA)的焊点共平面性进行检测。BGA和FCB用于飞机和医疗设备中的关键任务设备。为了保证封装的质量，半导体封装企业要求在自动光学共面性检测仪器中使用成本更低、体积更小、成像速度更快的光学传感器，以确保封装组装的可靠性和质量。电子行业对增加电路密度、提高集成度和提高性价比的需求导致了BGA和FCB的使用激增。这将减少芯片故障和系统故障。这些高可靠性的设备最终可能会拯救生命，提高生活质量。

This Small Business Innovation Research (SBIR) project is to develop innovative miniature con-focal laser scanning sensors for semiconductor packaging processes by using diode laser detector array chips. There are no moving parts in this sensor for scanning, unlike other con-focal devices. This sensor with a fast imaging rate will be integrated with chip IC placement robot machines, to inspect solder bump co-planarity of Flip Chip Bonding (FCB) and the ball of Ball Grid Arrays (BGA) before packaging. BGA and FCB are used in mission critical devices in airplanes and medical devices. To ensure quality of the packaging, semiconductor-packaging companies demand lower cost, smaller, fast imaging optical sensors in the automatic optical co-planarity inspection instruments to ensure the reliability and quality of package assembly. The electronics industry's demands for increasing circuit density, higher levels of integration and improved cost/performance capabilities have led to the proliferation of the use of BGA and FCB. This will reduce chip failures and system failures. These high reliability devices may eventually save lives and improve the quality of life.