SBIR Phase II: An Optical Sensor for Semiconductor Back-End Processes

SBIR 第二阶段：用于半导体后端工艺的光学传感器

• 批准号: 0320062
• 负责人: Jim Hang
• 金额: $ 50万
• 依托单位: New Dimension Research
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-11-15 至 2005-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0320062&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Optical; Sensor

This Small Business Innovation Research (SBIR) project is to develop innovative miniature con-focal laser scanning sensors for semiconductor packaging processes by using diode laser detector array chips. There are no moving parts in this sensor for scanning, unlike other con-focal devices. This sensor with a fast imaging rate will be integrated with chip IC placement robot machines, to inspect solder bump co-planarity of Flip Chip Bonding (FCB) and the ball of Ball Grid Arrays (BGA) before packaging. BGA and FCB are used in mission critical devices in airplanes and medical devices. To ensure quality of the packaging, semiconductor-packaging companies demand lower cost, smaller, fast imaging optical sensors in the automatic optical co-planarity inspection instruments to ensure the reliability and quality of package assembly. The electronics industry's demands for increasing circuit density, higher levels of integration and improved cost/performance capabilities have led to the proliferation of the use of BGA and FCB. This will reduce chip failures and system failures. These high reliability devices may eventually save lives and improve the quality of life.

这个小型企业创新研究（SBIR）项目是利用二极管激光探测器阵列芯片开发用于半导体封装工艺的创新型微型共聚焦激光扫描传感器。与其他共焦设备不同，该传感器中没有用于扫描的活动部件。这种具有快速成像速率的传感器将与芯片IC放置机器人机器集成，用于在封装前检查倒装芯片键合（FCB）和球栅阵列（BGA）的焊料凹凸共面性。BGA和FCB用于飞机和医疗设备中的关键任务设备。为了保证封装的质量，半导体封装企业要求在自动光学共面检测仪器中使用成本更低、体积更小、成像速度更快的光学传感器，以保证封装组装的可靠性和质量。电子工业对增加电路密度、更高集成度和改进成本/性能能力的需求导致了BGA和FCB使用的扩散。这将减少芯片故障和系统故障。这些高可靠性的设备最终可能会挽救生命，提高生活质量。