SBIR Phase I: Optimized Microvia Generation Technology for Low-Cost Manufacturing of Electronic Modules

SBIR 第一阶段：用于电子模块低成本制造的优化微孔生成技术

• 批准号: 0214695
• 负责人: Marc Klosner
• 金额: $ 10万
• 依托单位: Anvik Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-07-01 至 2002-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0214695&HistoricalAwards=false
• 关键词: SBIR; Phase; Optimized; Microvia; Generation

This Small Business Innovation Research (SBIR) Phase I project addresses the requirement of high-density microvias, which are critical in a variety of microelectronic modules, such as Flat-Panel Displays (FPDs), Multi-Chip Modules (MCMs), and Printed Circuit Boards (PCBs). As these modules become ever faster, more compact, and more capable, their density of interconnects has been increasing dramatically and new packaging technologies such as Chip-Scale Packages (CSPs) and Ball-Grid Arrays (BGAs) have been developed to accommodate all the required input and output (I/Os) connections. Such dense interconnects are realized by the generation of hundreds of thousands of microvias in the substrate layers on which the electronic modules are built. These microvias are also both difficult and expensive to produce because of their small sizes and large numbers. Current technologies for microvia generation are not optimized for the varied cost considerations of different manufacturing requirements direct-write tools address low-volume needs, whereas mask projection systems are designed for very high via-density products. The system technology described in this proposal offers several desirable features, including: high-speed microvia generation for different via densities, full microvia pattern programmability, capability to drill high-threshold photo-ablation substrates, and full and efficient utilization of available high-power excimer lasers.A variety of microelectronic modules, such as flat panel displays, multi-chip modules, and printed circuit boards play an important role in numerous advanced technology applications in both commercial and military systems. Results from this project could result in substantial cost reductions in a wide range of electronic modules.

这个小型企业创新研究（SBIR）第一阶段项目解决了高密度微通孔的需求，这在各种微电子模块中至关重要，如平板显示器（FPDs）、多芯片模块（mcm）和印刷电路板（pcb）。随着这些模块变得越来越快，更紧凑，更强大，它们的互连密度急剧增加，并且已经开发出新的封装技术，如芯片级封装（csp）和球栅阵列（bga），以适应所有所需的输入和输出（I/ o）连接。这种密集的互连是通过在构建电子模块的基板层上产生数十万个微通孔来实现的。这些微型过孔由于体积小、数量多，生产起来既困难又昂贵。当前的微孔生成技术没有针对不同制造要求的各种成本考虑进行优化，直接写入工具解决了小批量需求，而掩模投影系统是为非常高的过孔密度产品设计的。本提案中描述的系统技术提供了几个理想的特性，包括：不同通孔密度的高速微通孔生成，全微通孔模式可编程性，钻取高阈值光烧蚀基板的能力，以及充分有效地利用可用的高功率准分子激光器。各种微电子模块，如平板显示器、多芯片模块和印刷电路板，在商业和军事系统的众多先进技术应用中发挥着重要作用。这个项目的成果可以大大降低各种电子模块的成本。