Acquisition of an Inductively Coupled Plasma Etching System for Research and Education

该奖项来自材料研究仪器项目，支持俄亥俄州立大学电感耦合反应离子蚀刻（ICP-RIE）系统的采购。该设施将立即在俄亥俄州立大学产生新的材料和材料相关的研究项目，并与跨学科合作伙伴进行大量合作。它将对几个学术部门现有的基于电子材料的研究项目产生巨大的影响，其中许多项目目前由国家科学基金会支持。该设备设计用于研究水平和中试线等离子体处理，使用腐蚀性处理气体如Cl2， BCl3或SiCl4。它有一个自动开关双功率范围射频发生器，这使得蚀刻在非常低的离子能量。该设施的形成将使全州的大学间研究项目得以结合，这些项目涵盖了ICP-RIE处理对半导体特性的影响的基础研究，以及新型器件结构、异质结构和纳米结构的开发。为此目的所选择的设备是明确为这种灵活的利用而设计的，以便达到预期的活动的广度和广泛的影响。俄亥俄州立大学将获得一套电感耦合反应离子蚀刻（ICP-RIE）系统，通过材料研究仪器项目的拨款，建立一套最先进的设备，用于等离子体加工各种电子和光子材料。该设施将立即在俄亥俄州立大学产生新的材料和材料相关的研究项目，并与跨学科合作伙伴进行大量合作。一旦到位，ICP-RIE将迅速吸引地方和全州范围内的工业联合项目，范围从传感器技术到光子学和能源转换技术。为了确保对多个用户开放访问，ICP-RIE系统将被放置在我们完善的半导体处理洁净室结构中，用于俄亥俄州立大学内外数十名本科生、研究生和博士后的研究和教育。最后，ICP-RIE系统将使我们能够处理各种材料，这是我们目前缺乏的核心能力。该系统将补充现有的洁净室设施，因此，通过几乎所有使用洁净室设施的项目所获得的杠杆作用，其影响将大大增强。

This award from the Instrumentation for Materials Research program supports the acquisition of an inductively coupled reactive ion etching (ICP-RIE) system at The Ohio State University. This facility will immediately generate new materials and materials-allied research programs at Ohio State with substantial teaming amongst interdisciplinary partners. It will have enormous impact on a very wide range of existing electronic materials - based research programs in several academic departments, many of which are currently supported by NSF. The equipment is engineered for research level and pilot line plasma processing using corrosive processing gases such as Cl2, BCl3 or SiCl4. It has an automatic switch dual power range RF generator, which makes etching possible under very low ion energies. The formation of this facility will allow the coalescence of inter-university research programs across the state, that span fundamental studies on the effects of ICP-RIE processing on the properties of semiconductors to the development of novel device structures, heterostructures and nanostructures. The equipment chosen for this purpose is explicitly designed for such flexible utilization, so that the breadth of activities and wide ranging impact expected will be achieved. %%%With this award from the Instrumentation for Materials Research program The Ohio State University will establish a state-of-the-art facility for the plasma processing of a wide range of electronic and photonics materials, with the acquisition of an inductively coupled reactive ion etching (ICP-RIE) system. This facility will immediately generate new materials and materials-allied research programs at Ohio State with substantial teaming amongst interdisciplinary partners. Once in place, the ICP-RIE will rapidly attract local and statewide industrial joint projects ranging from sensor technologies to photonics and energy conversion technologies. To ensure open access to multiple users, the ICP-RIE system will be placed into our well-established Semiconductor Processing Clean room structure to be employed in the research and education of dozens of undergraduate and graduate students and postdoctoral associates from both inside and outside Ohio State. Finally, the ICP-RIE system will allow us the ability to process a wide range of materials, a core capability that we are currently lacking. This system will complement existing facilities in the clean room, and thus its impact will be greatly enhanced by the leveraging obtained via almost all projects using the clean room facilities.