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GOALI: Investigating Metrology Issues in Chemical Mechanical Planarization Process for Microelectronics Manufacturing

GOALI: Investigating Metrology Issues in Chemical Mechanical Planarization Process for Microelectronics Manufacturing
GOALI:研究微电子制造化学机械平坦化工艺中的计量问题
批准号:
0218141
负责人:
Ashok Kumar
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2002
资助国家:
美国
项目状态:
已结题
起止时间:
2002-09-01 至 2007-08-31

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中文摘要
翻译
根据与Agere Systems Inc.合作的学术联络资助机会(GOALI),拟议活动的目标是开发一个强大的、整合良好的研究和教育计划,重点是了解半导体制造应用中化学机械平坦化(CMP)工艺的机械和摩擦学特性。低k材料在金属化结构中的集成在工艺集成期间产生了严重的问题。在加入低k材料后,工艺集成中的主要挑战之一是这些薄膜的化学机械抛光(CMP),因为降低了模数和结合强度。由于化学机械抛光技术的出现,使得化学机械抛光过程中产生的摩擦力变得非常重要,成为电介质和金属薄膜平坦化的首选方法。了解包含低k介质的复杂堆栈的机械和摩擦学特性对于成功评估和实施这些材料至关重要,拟议研究的主要目标是从根本上了解表面平坦化的本质,并确定控制化学机械抛光过程的机理。作为这项目标提议的一部分,Agere Systems Inc.将支持实物服务,如:a)提供化学机械抛光耗材(晶片、浆料和焊盘)以执行化学机械抛光实验;b)提供来自行业的工程师/科学家担任论文/学位论文顾问;b)为研究生提供常驻工作空间以及支持研究的所有现场材料和用品成本;c)指派一名工程师/科学家(约10%的时间用于工作并监督研究进展),e)强调技术转让和研究成果在制造中的实施。这项GOALI建议旨在通过为教师、博士后研究员和学生提供在工业环境中进行研究和获得生产过程经验的机会,来协同AGERE和USF的伙伴关系。大学与行业的合作将为学生提供更多与工业科学家合作的机会,并使用他们额外的最先进的设备设施。除了提供实践经验外,拟议的研究还将为学生提供参与跨学科研究的独特机会--这是未来取得成功的必要条件。该项目的成果将在区域和国家会议上以论文形式传播,并在适当的科学期刊上发表。
英文摘要
The objective of the proposed activities under the Grant Opportunities for Academic Liaison with Industry (GOALI) with Agere Systems Inc. is to develop a strong well-integrated research and education program focused on the understanding of the mechanical and tribological properties of chemical mechanical planarization (CMP) processes for semiconductor manufacturing applications. Integration of low-k materials in the metallization structures creates severe problems during process integration. One of the major challenges in the process integration after the incorporation of low-k materials is CMP of these films due to the reduced modulus and cohesive strength. Due to the emergence of CMP as the method of choice for global planarization of dielectric and metal films, the frictional forces generated during the CMP process have assumed significant importance. Understanding the mechanical and tribological properties of complex stacks involving low-k dielectrics is critical for successful evaluation and implementation of these materials and the main goals of the proposed research are to obtain the fundamental understanding of the nature of surface planarization and identify the mechanism to control the CMP process. As part of this GOALI proposal, Agere Systems Inc. will support as in-kind services like: a) provide CMP consumables (wafer, slurry, and pad) to perform the CMP experiments, b) provide engineer/scientist from the industry to serve as a thesis/dissertation advisor, b) provide resident workspace for a graduate student together with all on-site cost of materials and supplies to support the research, c) assign one engineer/scientist (approximately 10 % of their time to work and monitor the progress of the research), e) to emphasize technology transfer and implementation of research findings in manufacturing. This GOALI proposal aims to synergize the Agere-USF partnership by providing opportunities for faculty, postdoctoral fellows and students to conduct research and gain experience with production processes in an industrial setting. The university-industry collaboration will provide additional opportunity for students to work with industrial scientists and use of their additional state-of-the-art equipment facilities. Apart from providing hands-on experience, the proposed research will provide a unique opportunity for the students to be involved in interdisciplinary research- a must for future success. Results of the project will be disseminated by paper presentation in regional and national conferences, and published in appropriate scientific journals
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