Study of Reliability and Modeling for Process Optimization and Yield Improvements in Chemical Mechanical Planarization

化学机械平坦化工艺优化和产量提高的可靠性和建模研究

• 批准号: 0727320
• 负责人: Ashok Kumar
• 金额: $ 30万
• 依托单位: University of South Florida
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2012-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0727320&HistoricalAwards=false
• 关键词: Study; Reliability; Modeling; Process; Optimization

The objective of this research is to optimize the chemical mechanical planarization process using experimental evaluation of mechanical reliability of low dielectric constant materials. Extensive post surface metrology, mechanical and interfacial analysis of the materials, and consumables like pad and slurry used in polishing will be done to gain a fundamental analysis of the planarization process from different perspectives. The research will investigate the roles played by the consumables on surface defect generation at the fundamental level. This investigation will allow optimization of pad design, material selection, process pressure, orbital and linear speed, chemical solution, within wafer uniformity and local planarization. Modeling of interfacial adhesion will allow optimization of process conditions, pad physical properties, and chemical additives in order to reduce within uniformity and delamination of thin film stacks. Reliability issues related to dielectric materials will provide an optimal solution for improved yield without compromising the throughput.If successful, the finding of this investigation will result in improved equipment and process designs as well as significant reduction in design cycle time and cost. The research will have a profound impact on integration, device yield, and consumables development resulting in a significant economic payoff. The research will be integrated into existing and new courses in the investigators program and other steps will be taken to stimulate the interest of undergraduates and minority student engineers in microelectronics industries. The results will be disseminated in a timely manner through presentation at national/international conferences and publications in archival journals.

本研究的目的是通过低介电常数材料机械可靠性的实验评估来优化化学机械平坦化工艺。将对材料以及抛光中使用的垫和浆料等消耗品进行广泛的后表面计量、机械和界面分析，以便从不同角度对平坦化过程进行基本分析。该研究将从根本上调查消耗品对表面缺陷产生的作用。这项研究将允许优化焊盘设计、材料选择、工艺压力、轨道和线速度、化学溶液、晶圆均匀性和局部平坦化。界面粘附力建模将允许优化工艺条件、垫物理特性和化学添加剂，以减少薄膜堆栈的均匀性和分层。与介电材料相关的可靠性问题将为在不影响产量的情况下提高产量提供最佳解决方案。如果成功，本次调查的结果将改进设备和工艺设计，并显着缩短设计周期时间和成本。该研究将对集成、设备良率和消耗品开发产生深远影响，从而产生显着的经济回报。该研究将被纳入研究者计划的现有课程和新课程中，并将采取其他措施来激发本科生和少数族裔学生工程师对微电子行业的兴趣。研究结果将通过在国内/国际会议上发表和在档案期刊上发表来及时传播。