THERMEC' 2003 International Conference on Processing and Manufacturing of Advanced Materials; Madrid, Spain; July 7-11, 2003

THERMEC 2003年先进材料加工与制造国际会议；

• 批准号: 0304921
• 负责人: Brajendra Mishra
• 金额: $ 1万
• 依托单位: Colorado School of Mines
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-03-01 至 2004-02-29
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0304921&HistoricalAwards=false
• 关键词: THERMEC; 2003; International; Conference; Processing

The international conference THERMEC 2003 is planned for Madrid, Spain in July, 2003. Three earlier THERMEC conferences were held in Japan (1988), Australia (1997) and United States (2000). As a result of resounding success of the LasVegas-2000-conference, and demand by researchers around the globe, the 2003-conference is planned on cutting-edge materials research with emphasis on processing, properties, fabrication, and applications of advanced materials. Around 12 scientific organizations from various parts of the world are co-sponsors of the conference. The conference covers a wide variety of materials topics including nanocrystalline, bio and eco materials as well as thin films and coatings. Other materials topics include light metals (Al, Mg, Ti), steels, composites, bulk amorphous materials, superalloys, coatings along with Residual Stresses, Textures, Severe Plastic Deformation, etc. About 28 keynote and 450 oral presentations are expected to be made with participation from 35 countries. The proceedings will be published by Trans Tech in the form of Materials Science Forum periodical series in 3 volumes.The support is directed toward assisting graduate students in attending the meeting for travel and/or meeting registration. This will avail an opportunity to a number of US graduate students in materials science in various academic institutions to get an exposure to the latest developments and excitements in this area. As in the earlier conferences, a committee of three people will be involved in the selection process. ENG/DMII is co-funding the current request.

THERMEC 2003国际会议计划于2003年7月在西班牙马德里举行。此前的三次THERMEC会议分别在日本（1988年）、澳大利亚（1997年）和美国（2000年）举行。由于LasVegas-2000会议的巨大成功，以及地球仪研究人员的需求，2003年会议计划在尖端材料研究方面，重点是先进材料的加工、性能、制造和应用。来自世界各地的大约12个科学组织是这次会议的共同赞助者。会议涵盖了各种各样的材料主题，包括纳米晶体，生物和生态材料以及薄膜和涂层。其他材料主题包括轻金属（铝，镁，钛），钢，复合材料，大块非晶材料，高温合金，涂层沿着与残余应力，纹理，严重塑性变形等约28个主题演讲和450个口头报告预计将与来自35个国家的参与。会议记录将由Trans Tech以材料科学论坛期刊系列的形式出版，共3卷。该支持旨在帮助研究生参加会议的旅行和/或会议注册。这将为美国各学术机构的材料科学研究生提供一个接触该领域最新发展和兴奋点的机会。与前几届会议一样，一个由三人组成的委员会将参与甄选过程。ENG/DMII正在共同资助目前的请求。