THERMEC' 2003 International Conference on Processing and Manufacturing of Advanced Materials; Madrid, Spain; July 7-11, 2003

THERMEC 2003国际会议计划于2003年7月在西班牙马德里举行。早先的三次THERMEC会议分别在日本（1988年）、澳大利亚（1997年）和美国（2000年）举行。由于拉斯维加斯2000年会议的巨大成功，以及全球研究人员的需求，2003年会议计划以尖端材料研究为重点，重点是先进材料的加工、性能、制造和应用。来自世界各地的大约12个科学组织是这次会议的共同赞助者。会议涵盖了各种各样的材料主题，包括纳米晶体，生物和生态材料以及薄膜和涂层。其他材料主题包括轻金属（Al, Mg, Ti），钢，复合材料，大块非晶材料，高温合金，涂层以及残余应力，纹理，严重塑性变形等。预计将有来自35个国家的约28个主题演讲和450个口头演讲。会议论文集将由Trans Tech以《材料科学论坛》系列期刊的形式出版，共3卷。支持的目的是帮助研究生参加会议的旅行和/或会议注册。这将为来自不同学术机构的美国材料科学研究生提供一个机会，让他们接触到该领域的最新发展和激动人心的事情。与之前的会议一样，一个三人委员会将参与评选过程。ENG/DMII共同资助当前的请求。

The international conference THERMEC 2003 is planned for Madrid, Spain in July, 2003. Three earlier THERMEC conferences were held in Japan (1988), Australia (1997) and United States (2000). As a result of resounding success of the LasVegas-2000-conference, and demand by researchers around the globe, the 2003-conference is planned on cutting-edge materials research with emphasis on processing, properties, fabrication, and applications of advanced materials. Around 12 scientific organizations from various parts of the world are co-sponsors of the conference. The conference covers a wide variety of materials topics including nanocrystalline, bio and eco materials as well as thin films and coatings. Other materials topics include light metals (Al, Mg, Ti), steels, composites, bulk amorphous materials, superalloys, coatings along with Residual Stresses, Textures, Severe Plastic Deformation, etc. About 28 keynote and 450 oral presentations are expected to be made with participation from 35 countries. The proceedings will be published by Trans Tech in the form of Materials Science Forum periodical series in 3 volumes.The support is directed toward assisting graduate students in attending the meeting for travel and/or meeting registration. This will avail an opportunity to a number of US graduate students in materials science in various academic institutions to get an exposure to the latest developments and excitements in this area. As in the earlier conferences, a committee of three people will be involved in the selection process. ENG/DMII is co-funding the current request.