X-Ray Microbeam Studies of Electromigration

这笔赠款旨在通过基于X射线微束衍射和荧光和其他实验技术的研究，以及与微结构相关的晶粒度模型和数值模拟，促进对类似于先进集成电路中所使用的铜基导线中的电迁移的理解。本研究的目的是研究界面和晶界结构、成分、晶粒取向和应变在电迁移中的作用。其目的是检验已被广泛应用于铝基导线中电迁移的唯象描述是否也适用于铜基导线中的电迁移。除了探索杂质在铜基导线电迁移中的作用外，该研究还包括详细的三维模型，通过与实验结果的比较来验证模型假设。此外，还将检验目前可用的Z*从头计算与电迁移现象的相关性，这些现象现在可以在铜基导线上通过实验获得。研究结果适用于使用铜互连的先进微电子封装。通过利哈伊大学和伦斯勒理工学院的研究小组之间的合作，以及通过与IBM以及橡树岭、布鲁克海文和阿贡国家实验室的各种合作者的接触，研究生将获得研究电迁移所用的理论和实验方法的经验，他们将学习在大学、工业和政府实验室环境中工作。本科生将通过LeHigh为正在考虑研究生学习的大四学生参加的研究选项课程，在RPI的计算方法课程，以及在LeHigh和RPI的暑期实习生。这笔赠款旨在通过基于X射线微束衍射和荧光以及其他实验技术的研究，以及微结构相关、颗粒尺度模型和数值模拟，促进对铜基导线中电迁移的理解，这些导线类似于先进集成电路中使用的那些导线。本研究的目的是研究界面和晶界结构、成分、晶粒取向和应变在电迁移中的作用。其目的是检验已被广泛应用于铝基导线中电迁移的唯象描述是否也适用于铜基导线中的电迁移。除了探索杂质在铜基导线电迁移中的作用外，该研究还包括详细的三维模型，通过与实验结果的比较来验证模型假设。此外，还将检验目前可用的Z*从头计算与电迁移现象的相关性，这些现象现在可以在铜基导线上通过实验获得。研究结果适用于使用铜互连的先进微电子封装。通过利哈伊大学和伦斯勒理工学院的研究小组之间的合作，以及通过与IBM以及橡树岭、布鲁克海文和阿贡国家实验室的各种合作者的接触，研究生将获得研究电迁移所用的理论和实验方法的经验，他们将学习在大学、工业和政府实验室环境中工作。本科生将通过LeHigh为考虑研究生学习的大四学生开设的研究选项课程、RPI的计算方法课程以及LeHigh和RPI的暑期实习生参加*。

The grant explores to advance understanding of electromigration in copper-based conductor lines similar to those used in advanced integrated circuits through studies based on x-ray microbeam diffraction and fluorescence and other experimental techniques, together with microstructure-dependent, grain scale models, and numerical simulations. The objective of the study is to investigate the role of interface and grain boundary structure, composition, grain orientations, and strain in electromigration. The aim is to examine if the phenomenological descriptions of electromigration, which have been widely applied to electromigration in Al-based conductor lines, are also valid for electromigration in Cu-based conductor lines. Along with exploring the role of impurities in electromigration for Cu-based conductor lines, the research includes detailed, three-dimensional models at the grain scale to test model assumptions by comparison with experimental results. In addition, the relevance will be examined of currently available ab initio calculations of Z* to electromigration phenomena which are now experimentally accessible in Cu-based conductor lines.The research results are applicable to advanced microelectronic packaging utilizing Cu-interconnects. Through cooperation between research groups at Lehigh University and at Rensselaer Polytechnic Institute, and through contacts with various collaborators at IBM and at Oak Ridge, Brookhaven, and Argonne National Laboratories, graduate students will gain experience with theoretical and experimental methods used in studying electromigration, and they will learn to work in university, industrial, and government laboratory environments. Undergraduates will participate through a research option course at Lehigh for seniors who are considering graduate studies, a computational methods course at RPI, and as summer interns at Lehigh and RPI.The grant explores to advance understanding of electromigration in copper-based conductor lines similar to those used in advanced integrated circuits through studies based on x-ray microbeam diffraction and fluorescence and other experimental techniques, together with microstructure-dependent, grain scale models, and numerical simulations. The objective of the study is to investigate the role of interface and grain boundary structure, composition, grain orientations, and strain in electromigration. The aim is to examine if the phenomenological descriptions of electromigration, which have been widely applied to electromigration in Al-based conductor lines, are also valid for electromigration in Cu-based conductor lines. Along with exploring the role of impurities in electromigration for Cu-based conductor lines, the research includes detailed, three-dimensional models at the grain scale to test model assumptions by comparison with experimental results. In addition, the relevance will be examined of currently available ab initio calculations of Z* to electromigration phenomena which are now experimentally accessible in Cu-based conductor lines.The research results are applicable to advanced microelectronic packaging utilizing Cu-interconnects. Through cooperation between research groups at Lehigh University and at Rensselaer Polytechnic Institute, and through contacts with various collaborators at IBM and at Oak Ridge, Brookhaven, and Argonne National Laboratories, graduate students will gain experience with theoretical and experimental methods used in studying electromigration, and they will learn to work in university, industrial, and government laboratory environments. Undergraduates will participate through a research option course at Lehigh for seniors who are considering graduate studies, a computational methods course at RPI, and as summer interns at Lehigh and RPI.***