STTR Phase I: Rapid, Nondestructive Residual Stress Characterization of Semiconductor Materials

STTR 第一阶段：半导体材料的快速、无损残余应力表征

• 批准号: 0319448
• 负责人: Jon Lesniak
• 金额: $ 9.54万
• 依托单位: Stress Photonics Inc
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-07-01 至 2004-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0319448&HistoricalAwards=false
• 关键词: STTR; Phase; Rapid; Nondestructive; Residual

This Small Business Technology Transfer (STTR) Phase I project proposes to produce an infrared photo-elastic stress analysis system utilizing cutting edge technology analogous to visible light photo-elasticity and applied for the first time to optically opaque, yet infrared transparent, materials. The device will allow nondestructive, full-field stress characterization of silicon, compound semi-conductors, photonic materials, thin films, interfaces, and buried layers at a speed applicable to on-line inspection. Currently, residual stresses are not routinely measured because there are no efficient commercially available techniques. The result of Phase I will be an industrially driven design criteria for an instrument that can measure these residual stresses in a manner that is rapid, affordable, easy to master, and easy to justify. A prototype stress imager will find applications in nearly every portion of the micro-electronics industry including; wafer manufacture, device manufacture, microelectronics packaging, and MEMS devices. The proposed instrument will be relatively inexpensive, affordable enough for small universities, fabs, and engineering mechanics laboratories. Finally, commercial applications outside the electronics industry have been identified, including; inspecting thermal barrier coatings, measuring sintering stresses in ceramics as well as curing stresses in polymers and polymer composites.

这个小企业技术转让（STTR）第一阶段项目提出利用类似于可见光光弹性的尖端技术生产红外光弹性应力分析系统，并首次应用于光学不透明但红外透明的材料。 该设备将允许无损，全场应力表征硅，化合物半导体，光子材料，薄膜，界面和埋层的速度适用于在线检测。 目前，残余应力没有常规测量，因为没有有效的商业可用的技术。第一阶段的结果将是一个工业驱动的设计标准的仪器，可以测量这些残余应力的方式是快速的，负担得起的，易于掌握，并容易证明。 应力成像仪的原型将在微电子工业的几乎每一个部分中找到应用，包括：晶片制造、器件制造、微电子封装和MEMS器件。拟议的仪器将是相对便宜的，负担得起的足够的小型大学，工厂和工程力学实验室。 最后，电子工业以外的商业应用已经确定，包括：检测热障涂层，测量陶瓷中的烧结应力以及聚合物和聚合物复合材料中的固化应力。