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RUI: MRI Acquisition of a Scanning Electron Microscope with Energy Dispersive X-Ray and C-Mode Scanning Acoustic Microscope for a Centralized Laboratory for Imaging and Metrology

RUI: MRI Acquisition of a Scanning Electron Microscope with Energy Dispersive X-Ray and C-Mode Scanning Acoustic Microscope for a Centralized Laboratory for Imaging and Metrology
RUI:为成像和计量集中实验室配备能量色散 X 射线和 C 模式扫描声学显微镜的扫描电子显微镜 MRI 采集
批准号:
0320869
负责人:
Sean Rommel
金额:
$40.64万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2003
资助国家:
美国
项目状态:
已结题
起止时间:
2003-09-01 至 2005-08-31

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中文摘要
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英文摘要
This major research instrumentation (MRI) grant is submitted within the framework ofthe Research in Undergraduate Institutions (RUI) program. The mission of this RUIsubmission is the establishment of a Centralized Laboratory of Imaging andMetrology (CLIM) at the Rochester Institute of Technology. The instrumentationrequested includes a scanning electron microscope (SEM) with energy dispersive X-ray(EDX) capability and a C-Mode Scanning Acoustic Microscope that would greatlyenhance RIT's ability to conduct competitive undergraduate research.Intellectual Merit: CLIM will build upon RIT's existing strengths in Semiconductor andMicrosystems fabrication and packaging to bridge the applied research gap between basicresearch and product commercialization. The impact of the proposed researchinstrumentation will be in the establishment of a strong research base for investigatorsand undergraduates. A major component of the investigators vision involvesestablishing the undergraduate research infrastructure required to (i) publish in refereedjournals by undergraduates, (ii) enhance RIT's credibility to funding agencies to securefunding for undergraduate research, and (iii) provide a superior environment forundergraduate education.Various examples of research activity enabled by this equipment listed in the ProjectDescription section of this proposal include: photonic lightwave integrated circuitsfabrication, wafer bonding, microfluidic package analysis, packaging yield analysis, andSilicon on Insulator substrate characterization. These diverse efforts share a commonneed to characterize (i) material properties, (ii) process development, and (iii) failuremechanisms. Nondestructive structural, and chemical analysis and nanometer-scaleimaging capability is fundamental to the success of the proposed research initiatives. Thescanning electron microscope, energy dispersive X-ray, and a C-Mode Scanning AcousticMicroscope enable imaging, chemical analysis, and structural analysis, respectively.Broader Impact: In the first year of this program alone, it is estimated that throughprojects, classroom instruction, and research, 150 students will benefit from thisinstrumentation. This equipment will be introduced immediately, as a centerpiece toseveral classes, which include the following: EMCR 201 (Introduction to MicroelectronicEngineering), EMCR 221 (Introduction to Microlithography), EMCR 350 (ICTechnology), EMCR 564 (Microlithography Systems), EMCR 643 (Thin FilmProcessing), EMCR 650 (IC Processing Laboratory), EMCR 680/690 (Senior SeminarResearch), ITFF 455 (Introduction to Surface Mount Electronics Packaging), ITFF 456(Advanced Concepts in Electronics Packaging), and ITFF 457 (Electronics PackagingLaboratory).The research will be conducted by three faculty from RIT (S. L. Rommel-MicroelectronicEngineering, A.D. Raisanen-Semiconductor Microsystems Fabrication Laboratory, andS.M. Ramkumar- Manufacturing Mechanical Engineering Technology and PackagingScience) in the area of materials, process and failure characterization of microsystemsdevelopment and packaging. This project will foster collaboration between device andpackaging researchers at RIT to realize next-generation, high-performance microsystems.
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