SBIR Phase II: Reactive Mounting of Heat Sinks

这个小企业创新研究（SBIR）二期项目引入了一种新的反应性连接工艺，用于将散热器安装到芯片、芯片封装和基板上。该工艺使用反应性多层箔作为熔化焊料层的局部热源，从而粘合组件。这种箔是一种新型的纳米工程材料，在这种材料中，自传播的放热反应可以在室温下用火花点燃。这项工作的重点是在服务器芯片上安装散热器，这是一个迫切需要提高性能的应用。将考虑两种替代方案-将铜散热器安装在围绕芯片的金属化散热器上，以及将散热器直接安装在金属化芯片上。由于粘合剂、润滑脂和环氧树脂等现有方法存在导热性差、机械强度低和/或易降解等局限性，因此需要对微电子器件的热传导进行重大改进。随着微电子器件尺寸的减小和速度的提高，散热不良已经开始限制器件的性能和应用，从而成为一个关键问题。微电子器件热管理的全球市场约为37亿美元/年，高端散热器安装约占该市场的10%。

This Small Business Innovation Research (SBIR) Phase II project introduces a new reactive joining process for mounting heat sinks onto chips, chip packages and substrates. The process uses reactive multi-layer foils as local heat sources for melting solder layers, and consequently bonding the components. The foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be ignited at room temperature with a spark. The work will focus on reactive mounting of heat sinks onto server chips, an application that is in critical need of performance improvements. Two alternatives will be considered - the reactive mounting of a copper heat sink onto a metallized heat spreader that surrounds the chip, and reactive mounting of the heat sink directly onto a metallized chip. Significant improvements in heat conduction in microelectronic devices are needed as existing approaches such as adhesives, greases and epoxies suffer a number of limitations such as poor thermal conductivity, low mechanical strength and/or susceptibility to degradation. With the decrease in the size and the increase in speed of microelectronic devices, poor heat dissipation has started to limit device performance and applications and thus has become a critical issue. The worldwide market for thermal management in microelectronic devices is about $3.7 billion/year and high-end heat-sink mounting constitutes approximately 10% of this market.