SBIR Phase II: Reactive Multilayer Joining of Metals and Ceramics

这个小型企业创新研究第二阶段项目建议开发连接金属和陶瓷组件的技术；这是一种反应性连接过程，使用反应性多层箔作为熔化焊料的局部热源。这些薄膜是一类新型的纳米工程材料，可以在室温下使用热灯丝或激光引发自蔓延放热反应。通过在两个焊料层和两个部件之间插入多层箔，箔中的反应产生的热量熔化了焊料，从而将部件粘合在一起。这种新的焊接方法消除了对炉子或保护气氛的需要，并且通过非常局部的加热，避免了对部件的热损害。反应粘接过程比大多数竞争技术要快得多，并产生坚固且成本效益高的接头。最后，也可能是最重要的好处是，与多层箔连接可以使用无铅焊料，从而提供巨大的环境效益。该项目可能产生的更广泛影响可能是对微电子封装设施的影响。

This Small Business Innovation Research Phase II project proposes to develop technology for joining metallic and ceramic components; this is a reactive joining process that uses reactive multilayer foils as local heat sources for melting solders. These foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be initiated at room temperature using a hot filament or laser. By inserting a multilayer foil between two solder layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds the components. This new method of soldering eliminates the need for a furnace or protective atmospheres and, with very localized heating, avoids thermal damage to the components. The reactive bonding process is far more rapid than most competing technologies, and results in strong and cost-effective joints. The last and potentially most important benefit is the fact that joining with multilayer foils enables the use of lead free solders and therefore offers tremendous environmental benefits. The broader impacts that could result from this project could be to microelectronic packaging facilities.