SBIR Phase I: Ultra-Fine Solder Powder For Electronic Soldering

SBIR 第一阶段：用于电子焊接的超细焊粉

• 批准号: 0339679
• 负责人: Robert Dean, Jr.
• 金额: $ 10万
• 依托单位: SYNERGY INNOVATIONS INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-01-01 至 2004-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0339679&HistoricalAwards=false
• 关键词: SBIR; Phase; Ultra; Fine; Solder

This Small Business Innovation Research Phase I project will demonstrate the feasibility of limiting surface oxidation of ultra-fine (1-10 micron) solder powder for electronic solder paste. Today, the use of ultra-fine powder for increased resolution of paste printing on printed wiring boards (PWBs) is impeded by the excessive oxide burden on the powder's huge surface area. If this impediment could be removed, and ultra-fine powders were supplied commercially, not only could PWB component population density increase by 10 times or more, but new forms of solder-paste printing, such as Drop-on-Demand, could be innovated. In this project, oxide control will be demonstrated with two approaches: 1) oxygen-barrier coatings applied in the powder-production apparatus and 2) addition of trace amounts of alloying metals which can protect the powder surface. Assay methods that can profile, in nanometer steps, the oxide layer on the solder spheres, will be employed. The ultra-fine powder will be produced by an existing process developed under an NSF/SBIR Phase II award.The commercial application of this project is in the manufacture of printed wiring boards. The world sales of solder paste for surface-mounted components on PWBs is more than $500million/year. Most of the paste is applied by stencil/squeegee printing. That process wastes about 30% of the paste or about $150 million per year. One objective of this project is to reduce waste by higher resolution printing. However, that cannot be achieved unless ultra-fine solder powder is available at a competitive price (about $0.05/g). As components become smaller (e.g., flip chips), the population is controlled by paste-printing resolution, not by component size. Financial implications of these outcomes should be sizeable.

这个小型企业创新研究第一阶段项目将证明限制电子焊膏用超细（1-10微米）焊料粉表面氧化的可行性。如今，使用超细粉末来提高印刷线路板（PWB）上的膏体印刷的分辨率受到粉末巨大表面积上过量氧化物负担的阻碍。如果能够消除这一障碍，并在商业上提供超细粉，不仅可以将PWB组件的密度增加10倍或更多，而且可以创新新的焊膏印刷形式，如按需滴印。在本项目中，氧化物控制将通过两种方法进行演示：1）在粉末生产设备中应用氧气阻隔涂层，2）添加微量合金金属，可以保护粉末表面。分析方法，可以配置文件，在纳米步骤，焊料球上的氧化层，将被采用。该超细粉体将采用NSF/SBIR第二阶段项目下开发的现有工艺生产。该项目的商业应用是印刷线路板的制造。用于印刷线路板表面贴装元件的焊膏的全球销售额超过5亿美元/年。大部分的膏体是通过模版/丝网印刷来施加的。这一过程每年浪费约30%的糊状物或约1.5亿美元。该项目的一个目标是通过更高分辨率的打印来减少浪费。然而，除非超细焊料粉末以具有竞争力的价格（约0.05美元/克）获得，否则无法实现这一目标。随着组件变得更小（例如，倒装芯片），则群体由粘贴印刷分辨率控制，而不是由组件尺寸控制。这些成果所涉经费问题应该相当大。