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Collaborative Research: Efficient Fabrication of Microelectromagnetic Devices by Micromolding

Collaborative Research: Efficient Fabrication of Microelectromagnetic Devices by Micromolding
合作研究:通过微成型有效制造微电磁器件
批准号:
0400061
负责人:
Wen Meng
金额:
$30.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2004
资助国家:
美国
项目状态:
已结题
起止时间:
2004-05-15 至 2008-04-30

项目摘要

项目成果

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中文摘要
翻译
路易斯安那州立大学(LSU)和威斯康星大学(UW)的这一合作项目提出了一种混合方法来进一步推进高温金属微成型技术。通过结合LIGA、微尺度电火花加工、高密度等离子体刻蚀和光滑以及高温纳米结构陶瓷涂层的元素,我们的目标是实现Ni-Fe合金的高温微成型,并建立Ni-Fe基电磁微执行器。智力优势:将金属微成型技术推向更高的温度(~800 oC)需要在以下几个方面进行重要研究:1)开发高效制造复杂、大深宽比、高温材料的微尺度图形2)了解控制纳米结构陶瓷涂层高温结构和化学稳定性的关键因素3)了解陶瓷纳米复合材料与Ni-Fe合金之间滑动接触的高温摩擦化学4)了解高温微成型过程的机理5)通过微模成型改进用于制造的微电磁设备的设计这些研究元素的完善和集成为金属基伤害设备的高温微制造奠定了科学基础。广泛的影响:通过模塑以低成本复制金属和合金基损伤的能力为许多微电磁、微机械和微化学设备的商业化提供了潜力。通过路易斯安那州立大学和吴大学联合举办的工作坊,将促进两所院校学生之间的互动。这项计划中的研究让研究生接触到不同的学科。通过路易斯安那州立大学和南方大学(SU)之间的持续互动,我们将吸引少数族裔学生从事微制造研究,并将他们招入路易斯安那州立大学和南方大学的研究生课程。
英文摘要
This collaborative project from Louisiana State University (LSU) and University of Wisconsin (UW) proposes a hybrid approach to further advance the technology of high temperature metal micromolding. By combining elements of LiGA, microscale electrical discharge machining, high density plasma etching and smoothing, and high temperature nanostructured ceramic coatings, we aim to achieve high temperature micromolding of Ni-Fe alloys and build Ni-Fe based electromagnetic microactuators.Intellectual merit: Pushing the technology of metal micromolding to much higher temperatures (~800 oC) entails undertaking significant research in a number of areas:1) Developing new means of efficient fabrication of complex, high-aspect-ratio, microscale patterns out of high temperature materials2) Understanding critical factors controlling high temperature structural and chemical stability of nanostructured ceramic coatings3) Understanding high temperature tribochemistry of sliding contacts between ceramic nanocomposites and Ni-Fe alloys4) Understanding mechanics of the high temperature micromolding process5) Improving design of microelectromagnetic devices for manufacturing by micromoldingCompletion and integration of these research elements lay the scientific foundation of high temperature micromanufacturing of metal-based HARMs devices.Broader impact: The ability to inexpensively replicate metal and alloy based HARMs by molding offers the potential for commercialization of numerous microelectromagnetic, micromechanical, and microchemical devices. Through joint LSU-WU workshops, interactions between students from both institutions will be promoted. The planned research exposes graduate students to diverse disciplines. Through ongoing interactions between LSU and Southern University (SU), we will interest minority students in micromanufacturing research, and recruit them into graduate programs at LSU and SU.
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GOALI/Collaborative Research: A Combined Materials and Mechanics Study on Failure and Materials Improvement of Coating/Substrate Interfaces
  • 批准号:
    0900167
  • 项目类别:
    Standard Grant
  • 资助金额:
    $20.01万
  • 财政年份:
    2009
  • 负责人:
    Wen Meng
  • 依托单位:
Fabrication of and Thermal Testing in Enclosed Metal Microchannels
  • 批准号:
    0556100
  • 项目类别:
    Standard Grant
  • 资助金额:
    $0.0万
  • 财政年份:
    2006
  • 负责人:
    Wen Meng
  • 依托单位:
TSE: High Temperature Micromolding of Aluminum Parts
  • 批准号:
    0124441
  • 项目类别:
    Standard Grant
  • 资助金额:
    $37.38万
  • 财政年份:
    2001
  • 负责人:
    Wen Meng
  • 依托单位:
国内基金
海外基金
Research on Quantum Field Theory without a Lagrangian Description
  • 批准号:
    24ZR1403900
  • 项目类别:
    省市级项目
  • 资助金额:
    --
  • 批准年份:
    2024
  • 负责人:
    SATOSHI NAWATA
  • 依托单位:
Cell Research
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