SGER: Analysis of the Thermophysical Properties of MEMS Materials

拟议的规划拨款将用于解决高温下MEMS器件热建模的不足之处。对于大多数用于MEMS制造的材料来说，高温下的热输运特性及其对微观结构演变的依赖是未知的。在这一年的规划期内，将进行试点研究，以解决热传导方面的挑战，同时将形成研究合作，以解决微尺度辐射传输问题。PI希望在温度高达1000℃的情况下测量100至5000nm之间薄膜的导热性。另外的材料表征实验将在多晶Si，金刚石和SiC薄膜上进行。实验研究将成为并行建模工作的基础。这项研究将导致向包括国家科学基金会在内的联邦资助机构提交几项研究提案，并最终有助于解决热MEMS器件的设计和可靠性问题，特别是在高温下。该合同由化学和运输系统分部的热传输和热处理项目资助。

The proposed planning grant will be used to address the inadequacies of thermal modeling of MEMS devices at elevated temperatures. Thermal transport properties at elevated tempeatures and their dependence on mmicrostructural evolution are unknown for most materials used in MEMS manufacturing. During this one-year planning period, pilot studies will be performed to address the challenges in thermal conduction, while research collaborations will be formed to address microscale radiation transport. The PI hopes to measure the thermal conductivity of thin films between 100 and 5000 nm for temperatures up to 1000 C. Additional materials characterization experiments will be conducted on thin films of polycrystalline Si, diamond, and SiC. The experimental study will form the basis for a parallel modeling effort. This study should lead to the submission of several research proposals to federal funding agencies, including the National Science Foundation, and could eventually help to address the design and reliabil9ity of thermal MEMS devices, especially at elevated temperatures.The award has been funded by the Thermal Transport and Thermal Processing Program of the Chemical and Transport Systems Division.