Acquisition of Instrumentation for Advanced Materials Characterization
Acquisition of Instrumentation for Advanced Materials Characterization
批准号:
0421058
负责人:
William Cross
金额:
$40.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2004
资助国家:
美国
项目状态:
已结题
起止时间:
2004-07-15 至 2005-06-30
中文摘要
要求的MRI设备将使三个SDSM T研究组,即智能结构组,复合材料组和直接写入技术组的持续增长和发展。综上所述,上述SDSM& T研究计划需要一套能够对组件进行高精度尺寸和轮廓测量以及精确测定材料特性的仪器。鉴于SDSM T研究工作的当前重点&,预计Nano-XP系统将用于以下研究领域:1)聚合物基复合材料的压痕测试(特别是称为界面的近纤维区域),和2)传感器/电路耐久性。此外,其他可能的领域包括摩擦搅拌加工材料的纳米和微观结构表征以及纳米复合材料的表征。一些不断发展的技术提供了令人兴奋的前景,同时也带来了重大的发展挑战。超轻重量设计和小型化是两个显著的例子。在这两种情况下,以及许多其他情况下,需要非接触式感测和测量。光学方法是最强大的非接触技术之一。ARAMIS 3D高分辨率散斑干涉仪具有成像表面的自然镜面反射特性,将与薄纱结构和直写多功能集成传感器一起使用。材料加工方法的最新进展,如直写制造,开辟了多功能结构元件的可能性。直写制造使得结构的承载元件能够被设计成用于感测和致动的附加功能。许多具有严格重量和尺寸限制的通信、医疗、空间和国防应用都需要可靠的多功能结构。所要求的动态MEMS光学轮廓仪系统是这些应用规模的理想选择。这套仪器的教育和培训机会非常大。在这方面,所要求的仪器将用于十多个课程,每年总共有400多名学生。此外,SDSM T拥有一个夏季REU站点,并有第二个REU站点待定,这两个站点都将使用该设备。最后,Raid City拥有一个新兴的电信行业,通过与应用电磁学和通信实验室(LAEC)和直接写入实验室的互动,将大大受益于所要求的设备。
英文摘要
AbstractThe requested MRI equipment will enable the continued growth and development of three SDSM&T research groups; namely, the smart structures group, the composites group and the direct write technology group. Taken together, the SDSM&T research initiatives mentioned above require a complementary suite of instruments capable of highly-accurate dimensioning and profiling of components, and the precise determination of material properties.Given the current focus of SDSM&T research efforts it is envisioned that the Nano-XP system would be utilized in the following research areas: 1) indentation testing of polymer matrix composites (particularly the near fiber region called the interphase), and 2) sensor/ circuitry durability. In addition, other possible areas would include characterization of nano and microstructure of friction stir processed material and characterization of nanofiber composites.Several evolving technologies offer exciting promise, while at the same time providing significant development challenges. Ultra-low weight design and miniaturization are two notable examples. In both of these cases, and many others, non-contact sensing and measurement are required. Optical methods are among the most powerful non-contact techniques. The proposed ARAMIS 3D high-resolution speckle interferometer featuring natural specular nature of the imaged surface will be used with gossamer structures and direct-write, multifunctional integrated sensors.Recent advances in materials processing methods, such as direct-write manufacturing, have opened up the possibility of multifunctional structural elements. Direct-write manufacturing enables load-carrying elements of a structure to be designed to serve the additional functions of sensing and actuation. A number of communications, medical, space, and defense applications with tight weight and size constraints are in need of reliable multifunctional structures. The requested dynamic MEMS optical profiler system is ideal at the scales of these applications.Significant opportunities exist for education and training with this suite of instruments. In this regard, the requested instruments would be utilized in over a dozen courses, totaling more than 400 students/year. In addition, SDSM&T hosts one summer REU site and has a second REU site pending, both of which would utilize this equipment. Finally, Raid City hosts a burgeoning telecommunications industry, which would greatly benefit from the requested equipment through interaction with the laboratory of applied electromagnetics and communications (LAEC) and direct write laboratory.
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MRI: Acquisition of a High-Resolution 3D X-Ray Microscopy System
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批准号:1126848
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项目类别:Standard Grant
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资助金额:$61.37万
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财政年份:2011
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负责人:William Cross
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依托单位:
海外基金