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Built-in Reliability through Environmental Stress Screening: Model Validation for Nano Products

Built-in Reliability through Environmental Stress Screening: Model Validation for Nano Products
通过环境应力筛选实现内置可靠性:纳米产品的模型验证
批准号:
0429176
负责人:
Way Kuo
金额:
$0.61万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2004
资助国家:
美国
项目状态:
已结题
起止时间:
2004-02-01 至 2007-05-31

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中文摘要
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英文摘要
Yield and reliability are key factors in determining success in the microelectronics and nano production industry. This proposal addresses a built-in-reliability approach that controls and predicts both reliability and yield in complex nano products. The purpose of this work is to find effective ways to screen the early failures that are so numerous and costly that the nano products industry has treated yield as privileged information. The proposed modeling techniques will be validated by analyzing the physical and electrical properties of the newly fabricated sub 5 nm high k dielectric devices for reliability testing. The objective of this project is to make it possible to more fully utilize nano systems by capitalizing on as yet underdeveloped potential for high reliability and affordable cost. The end results of the work will pave the way for reliability enhancement in nano products, and will define a paradigm for controlling yield and reliability as well. At the end, a new protocol for testing and testing standards will be devised.The 3-year multidisciplinary project is led by a microelectronics reliability specialist and a nano device engineer from different academic disciplines. The project will build a theoretical foundation for modeling nano reliability in cases where incompatibility dominates system performance. The publications and intellectual inventions that emerge from this project are expected to impact the nano industry as well as influence the material that is being taught in institutions of higher learning.
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Collaborative Research: Reliability Analysis of Spatial Systems with Local Interactions
  • 批准号:
    0825908
  • 项目类别:
    Standard Grant
  • 资助金额:
    $8.89万
  • 财政年份:
    2008
  • 负责人:
    Way Kuo
  • 依托单位:
Collaborative Research: Modeling Reliability for Scale-Driven Degradation and Spatial Defects
  • 批准号:
    0654290
  • 项目类别:
    Standard Grant
  • 资助金额:
    $12.57万
  • 财政年份:
    2007
  • 负责人:
    Way Kuo
  • 依托单位:
Built-in Reliability through Environmental Stress Screening: Model Validation for Nano Products
Strategic Issues on Yield, Reliability, and Their Relationship in Semiconductor Manufacturing
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