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Quality Through Engineering Design, a U.S.-India-Japan Conference, Bangalore, India, February 1992, Group Travel Award- Supplement

Quality Through Engineering Design, a U.S.-India-Japan Conference, Bangalore, India, February 1992, Group Travel Award- Supplement
Quality Through Engineering Design,美国-印度-日本会议,印度班加罗尔,1992 年 2 月,团体旅行奖 - 补充材料
批准号:
9017040
负责人:
Way Kuo
金额:
$4.9万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1991
资助国家:
美国
项目状态:
已结题
起止时间:
1991-05-01 至 1993-04-30

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中文摘要
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英文摘要
Description: This project supports U.S. participants to a U.S.-India-Japan Conference on Quality Through Engineering Design, planned for February 1992 in Bangalore, India. The trilateral conference is intended to accelerate the exchange of information on computer based and statistical approaches to the engineering design of quality products and processes. The conference is expected to last 5 days, and will consist of mainly invited papers and few contributed papers, and will allow for extensive formal and informal discussions. Seven major sessions are planned: materials formulation and processsing design; metrology in materials development; electro-mechanical design; metrology in electro-mechanical design; statistical quality engineering techniques for design; total quality control; and computer-aided design system requirements. The Indian organizer is Dr. B. K. Pal of the Indian Statistical Institute in Bangalore, India. The conference proceedings are expected to be published. Scope: Several organizations in the three countries are expected to support the conference including the Indian Institute of Technology, Madras, Indian Institute of Science, Bangalore, Baharat Heavy Electric Co., Bangalore, The National Aeronautical Laboratory and the Bureau of Indian Standards in India, the National Institute for Standard and Technology (NIST) in the U.S., and the Union of Japanese Scientists and Engineers in Japan. The topic of the conference is quite important to the U.S. and to India. The publication of the proceedings will be helpful to workers in this field in the U.S. academic and industrial organizations, and could lead to collaboration with Indian scientists. The project fits well with the objectives of the U.S.-India Cooperative Science Program.
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Collaborative Research: Reliability Analysis of Spatial Systems with Local Interactions
  • 批准号:
    0825908
  • 项目类别:
    Standard Grant
  • 资助金额:
    $8.89万
  • 财政年份:
    2008
  • 负责人:
    Way Kuo
  • 依托单位:
Collaborative Research: Modeling Reliability for Scale-Driven Degradation and Spatial Defects
  • 批准号:
    0654290
  • 项目类别:
    Standard Grant
  • 资助金额:
    $12.57万
  • 财政年份:
    2007
  • 负责人:
    Way Kuo
  • 依托单位:
Built-in Reliability through Environmental Stress Screening: Model Validation for Nano Products
  • 批准号:
    0429176
  • 项目类别:
    Standard Grant
  • 资助金额:
    $0.61万
  • 财政年份:
    2004
  • 负责人:
    Way Kuo
  • 依托单位:
Built-in Reliability through Environmental Stress Screening: Model Validation for Nano Products
国内基金
海外基金
基于Flow-through流场的双离子嵌入型电容去离子及其动力学调控研究
  • 批准号:
    52009057
  • 项目类别:
    青年科学基金项目
  • 资助金额:
    24.0万元
  • 批准年份:
    2020
  • 负责人:
    刘勇
  • 依托单位: