课题基金 / 基金详情

US-Japan Cooperative Program on Sensors, Smart Structures, and Mechatronic Systems

US-Japan Cooperative Program on Sensors, Smart Structures, and Mechatronic Systems
美日传感器、智能结构和机电系统合作项目
批准号:
0451274
负责人:
Billie Spencer
金额:
$0.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2004
资助国家:
美国
项目状态:
已结题
起止时间:
2004-09-15 至 2009-08-31

项目摘要

项目成果

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中文摘要
翻译
0451274PI:Billie F.Spencer,Jr.伊利诺伊大学香槟分校这个项目的目标是建立一个美日联合工作组,以开发符合共同利益并整合两国各自优势的传感器、智能结构和机电系统方面的双边研究计划。信息技术、通信和小型化等使能技术的进步,加上对更高性能、更多功能和以更低成本增强安全/可靠性的日益增长的需求,使传感器技术和基于传感器的智能系统工程处于重大增长的门槛。两国在该领域有着积极的研发活动,但这需要美国和日本研究人员的努力,以确定最有效和最有意义的合作主题和领域。将制定一项全面的计划,包括目标和目的、主要研究方向和重点、预期成果和里程碑、所需资源以及作为工业和教育组成部分及其价值的其他补充信息,以及它们对民用基础设施、航空航天和机电系统以及减轻地震灾害的影响的实际应用。这项工作的成功完成将促进更广泛的国际学生交流、通过试验台实验和研究数据的传输进行技术转让、对该区域的工程师进行智能结构设计的教育/培训,并促进智能结构和与区域工业的综合机电系统活动。
英文摘要
0451274PI: Billie F. Spencer, Jr.University of Illinois at Urbana-ChampaignThe objective of this project is to establish a US-Japan Joint Working Group to develop a bilateral research program in Sensors, Smart Structures, and Mechatronic Systems that meets the mutual interests and integrates the respective strengths of the two countries. Advances of enabling technologies such as information technology, communication and miniaturization coupled with ever increasing needs for higher performance, increased functionality and safety/reliability enhancement at reduced costs have set the sensor technology and the engineering of sensor-based intelligent systems at the threshold of major growth. The two countries have vigorous research and development activities in the field, but it requires efforts by both US researchers and Japanese researchers to identify topics and areas of most effective and meaningful collaboration. A comprehensive plan will be developed, including goals and objectives, major research directions and thrusts, anticipated outcome and milestones, resources needed, and other supplemental information as industrial and educational components and their values, and practical applications as they impact on the civil infrastructures, aerospace and mechatronic systems, and earthquake hazard mitigation. Successful completion of this effort will facilitate broader international student exchange, technology transfer thru test bed experiments and transfusion of research data, education /training of engineers in the region for smart structure design, and promote smart structures and integrated mechatronic systems activity with regional industries.
期刊论文(0)
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会议论文
Asia-Pacific Summer School on Smart Structures Technology (APSS), China 2011, India 2012, and Korea 2013
EAGER: Bio-Inspired Smart Sensor Networks for Adaptive Emergency Response
Building and Infrastructure Resilience: Strategic Planning for Speedy and Organized Emergency Response, Recovery, and Rebuilding
International Workshop on Advanced Smart Materials and Smart Structures Technology (2009)
海外基金