Chip- and wear mechanisms at high speed and high power grinding with planetary kinematic

行星运动学双面磨削是一种加工具有共面曲面的零件的加工工艺。这种制造过程的运动学导致刀具上的磨损轮廓不均匀，这对可到达的工件表面质量产生了负面影响。由于基于工艺参数变化的改进受到特殊工艺运动学的限制，因此仅使用具有可变磨削层规格的刀具就有可能增强工艺。该项目的主要目标是通过减少磨具上的齿形磨损来优化加工工艺。这种优化应通过设计磨损优化的砂轮来实现，以促进稳定的工艺性能。为实现这一主要目标，应将在第一个建议书阶段创建的分析模型以及基于软件的实施扩展到具有不同磨削层规格的工具。基于软件实现的结果，将开发出用于常规加工的刀具概念，其切割速度为vc=5m/S，以及用于前视高速加工的刀具概念，其切割速度为vc=25m/S。

Double face grinding with planetary kinematics is a process, which is used to machine workpieces with coplanar surfaces. The kinematic of this manufacturing process results in uneven wear profiles on the tool, which have a negative impact on the reachable workpiece surface quality. Because the improvement based on a variation of the process parameters is limited by the special process kinematic, it is possible to enhance the process only using tools with variable grinding layer specifications. The main target of this project covers the optimization of the machining process by reducing the profile wear on the grinding tool. This optimization shall be reached by designing wear optimized grinding wheels, which facilitate a stationary process performance. To achieve this main target, the analytical model as well as the software based implementation, which were created in the first proposal period, shall be extended for tools with variable grinding layer specifications. Based on the results generated by the software implementation, a tool concept for conventional machining with cutting speed of vc = 5 m/s as well as a tool concept for forward-looking high speed machining with cutting speed of vc = 25 m/s shall be developed.