Chip- and wear mechanisms at high speed and high power grinding with planetary kinematic

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Double face grinding with planetary kinematics is a process, which is used to machine workpieces with coplanar surfaces. The kinematic of this manufacturing process results in uneven wear profiles on the tool, which have a negative impact on the reachable workpiece surface quality. Because the improvement based on a variation of the process parameters is limited by the special process kinematic, it is possible to enhance the process only using tools with variable grinding layer specifications. The main target of this project covers the optimization of the machining process by reducing the profile wear on the grinding tool. This optimization shall be reached by designing wear optimized grinding wheels, which facilitate a stationary process performance. To achieve this main target, the analytical model as well as the software based implementation, which were created in the first proposal period, shall be extended for tools with variable grinding layer specifications. Based on the results generated by the software implementation, a tool concept for conventional machining with cutting speed of vc = 5 m/s as well as a tool concept for forward-looking high speed machining with cutting speed of vc = 25 m/s shall be developed.