STTR Phase I: Atomic Layer Deposition-Enabled Polymer Packaging for Integrating MEMS and Electronics

STTR 第一阶段：用于集成 MEMS 和电子产品的原子层沉积聚合物封装

• 批准号: 0539890
• 负责人: Markus Groner
• 金额: --
• 依托单位: ALD NANOSOLUTIONS, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-01-01 至 2007-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0539890&HistoricalAwards=false
• 关键词: STTR; Phase; Atomic; Layer; Deposition

This Small Business Technology Transfer (STTR) Phase I project will demonstrate a new nano-scale, conformal, atomic layer deposition (ALD)-enabled hermetic capping. Such an innovative capping technology will transform MEMS and electronics integration from dual-in-line packages (DIP) into chip-scale packages (CSP), wafer level packages (WLP) and three-dimensional (3-D) packages, which are required for low-costand super-compact systems. MEMS devices are mechanically protected by polymer layers with cavities. Polymer processing is fully compatible with existing WLP manufacturing for microelectronic components. To meet hermetic and/or vacuum requirements, a nano-scale (25 to 60 nm) ALD-alumina layer with a hydrophobic surface monolayer will be coated to provide comprehensive, conformal, pinhole-free protective coverage. This project will demonstrate the feasibility of this innovative concept by using a MEMS package sealed by a polymer structure coated with ALD-alumina and hydrophobic monolayer. The project will also demonstrate a product insertion process by transforming microelectronic non-hermetic CSPs into hermetic ones. The project will be applied to various CSPs produced by different manufactures.Commercially, packaging is recognized as one of the major barriers to the large scale commercialization of Micro-Electro-Mechanical Systems (MEMS). Wafer-level hermetic capping has enabled the integration of MEMS and electronics in dual-in-line (DIP) packages. This project creates a new paradigm to apply ALD for packaging of MEMS, microelectronic, optoelectronic and radio frequency (RF) components and systems. The potential impact of successful ALD applications to packaging extends far beyond the proposed hermetic sealing.

这个小企业技术转让（STTR）第一阶段项目将展示一种新的纳米级，保形，原子层沉积（ALD）启用密封封盖。这种创新的封盖技术将把MEMS和电子集成从双列直插式封装（DIP）转变为低成本和超紧凑系统所需的芯片级封装（CSP）、晶圆级封装（WLP）和三维（3-D）封装。MEMS器件由具有空腔的聚合物层机械保护。聚合物加工与微电子元件的现有WLP制造完全兼容。为了满足密封和/或真空要求，将涂覆具有疏水表面单层的纳米级（25至60 nm）ALD-氧化铝层，以提供全面、保形、无针孔的保护覆盖。该项目将证明这一创新概念的可行性，通过使用密封的聚合物结构与ALD-氧化铝和疏水单层的MEMS封装。该项目还将通过将微电子非密封CSP转换为密封CSP来演示产品插入过程。该项目将应用于不同制造商生产的各种CSP。商业上，封装被认为是微机电系统（MEMS）大规模商业化的主要障碍之一。晶圆级密封盖已使MEMS和电子器件能够集成在双列直插式（DIP）封装中。该项目创造了一个新的范例，将ALD应用于MEMS，微电子，光电和射频（RF）组件和系统的封装。ALD成功应用于包装的潜在影响远远超出了拟议的气密密封。