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SGER: Electrowetting Actuation of Droplets for Cooling of Integrated Circuits

SGER: Electrowetting Actuation of Droplets for Cooling of Integrated Circuits
SGER:用于冷却集成电路的液滴电润湿驱动
批准号:
0540004
负责人:
Kamran Mohseni
金额:
$0.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2006
资助国家:
美国
项目状态:
已结题
起止时间:
2006-04-15 至 2007-09-30

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中文摘要
翻译
摘要提案号:cts -050004首席研究员:Mohseni, kamrana隶属于:科罗拉多大学boulder提案题目:SGER:用于集成电路冷却的液滴电润湿驱动该奖项是由化学和传输系统部的热传输和热加工计划授予的探索性研究小额资助。热是电子设备正常工作时不可避免的副产品。电路延迟的减少和速度的提高通常是通过更高的电路封装密度来实现的,同时增加了每个电路的功耗。由于对包装密度和性能的需求增加,所需的热通量去除正在以具有挑战性的速度增加。为此,探索性研究小额资助(SGER)专注于离散液滴的电调制,以驱动和泵送液滴,特别是金属/合金,用于紧凑微系统的主动热管理和任何固体表面热点的热量去除。初步计算表明,使用这种技术具有显著的散热能力。智力优势:这项工作旨在提供定量数据来支持所建议的技术。提出的技术是基于两个观察:(i)通过使用在室温下是液体的金属/合金(而不是例如空气冷却),冷却系统的传热速率可以显着提高;(ii)电毛细管是一种高效,低功耗和低压的驱动技术,用于泵送液体在微观尺度。对这一系统的可行性分析将侧重于项目的两个不同方面。首先,将对电介质上的电润湿(适用于导电液体)和介电电泳(适用于电介质液体)进行建模,以找出给定驱动电压下的液滴速度和传热速率。为了验证这些模型,将进行实验,直接测量各种驱动参数下的传热系数和液滴速度。更广泛的影响:预计该项目将在紧凑型微系统的新型热管理技术方面取得创新进展。这项工作的成果将丰富科罗拉多大学博尔德分校现有的学科课程,扩大学生对热流体学、微制造和数值模拟的多学科接触。在此基础上,展望了致密微系统和微流体热管理的研究进展。这些将在国家会议上和通过期刊出版物广泛传播。
英文摘要
ABSTRACTProposal Number: CTS-050004Principal Investigator: Mohseni, KamranAffiliation: University of Colorado-BoulderProposal Title: SGER: Electrowetting Actuation of Droplets for Cooling of Integrated CircuitsThis award is for a Small Grant for Exploratory Research awarded by the Thermal Transport and Thermal Processing Program of the Division of Chemical and Transport Systems. Heat is an unavoidable byproduct of normal operation of an electronic device. Reduction in circuit delay and therefore an increase in speed are often achieved by higher circuit packaging density accompanied by increased power dissipation per circuit. As a result of more demand for increased packaging density and performance, the required heat flux removal is increasing at a challenging rate. To this end, this Small Grant for Exploratory Research (SGER) is focused on electrical modulation of discrete droplets for actuation and pumping of liquid droplets, in particular metals/alloys, for active thermal management of compact micro systems and heat removal from the hot spots on any solid surface. Preliminary calculations suggest significant heat removal capability by using this technique.Intellectual Merit: This effort is aimed at providing quantitative data in support of the proposed technique. The proposed technique is based on two observations: (i) By using metals/alloys that are liquid at room temperature (instead of e.g. air cooling) heat transfer rate of a cooling system can be enhanced significantly, (ii) Electrocapillary is an efficient, low power consumption, and low voltage actuation technique for pumping liquidsat micro-scales. Feasibility analysis for such a system will be conducted by focusing on two separate aspects of the project. First, modeling of both electrowetting on dielectric (for conductive liquids) and dielectrophoresis (for dielectric liquids) will be conducted tofind droplet velocity and heat transfer rate for a given actuation voltage. In order to validate these models, experiments will be conducted where the heat transfer coefficients and droplet velocities are directly measured for various actuation parameters.Broader Impacts: It is expected that this project will create innovative advances in a new class of thermal management techniques for compact micro systems. Existing disciplinary courses at CU Boulder will be enriched with results from this work, expanding studentmultidisciplinary exposure to thermofluidics, micro fabrication, and numerical simulation. Advances in thermal management of compact micro systems and micro fluidics are anticipated based on the research proposed in this investigation. These will be disseminated widely at national meetings and through journal publications.
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会议论文
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