Design Methodologies for Defect-Tolerant Computing Systems

容错计算系统的设计方法

• 批准号: 0541169
• 负责人: Valeria Bertacco
• 金额: $ 15万
• 依托单位: Regents of the University of Michigan - Ann Arbor
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-05-15 至 2010-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0541169&HistoricalAwards=false
• 关键词: Design; Methodologies; Defect; Tolerant; Computing

CCF-0541169 PI: Bertacco, Valeria Institution: University of Michigan Ann Arbor Title: Design Methodologies for Defect-Tolerant Computing Systems The proposal focuses on the development of computing systems capable of tolerating a moderate to medium number of defects in the silicon hardware. Silicon defects are a pressing problem for hardware parts, mainly because of the shrinking of transistors sizes down to a few tens of nanometers. The proposal attacks this goal from a few angles: first it develops a framework for the analysis of the impact and exposure risks associated with a range of silicon failures. In this context, the types of failures analyzed are: 1) soft-errors, that is, transient faults due to energy particles present in the atmosphere, which are estimated to be relevant for silicon technologies in the next few years; 2) manufacturing defects due to the imprecision of manufacturing small scale transistor parts; and 3) wear-out failures, due to the weakening of transistors as they approach nanometer sizes. The second goal of the proposal develops software to support the analysis and evaluation of a range of potential future scenarios, which include these types of failures. Finally, the third goal of this proposal develops two experimental microprocessor designs which explore two solutions points in the resilient systems design space: one design can sustain a medium to high level of defects, while the other can sustain only the first failure but with a minimum cost and performance impacts.

CCF-0541169 PI：Bertacco, Valeria 机构：密歇根大学安娜堡分校 标题：容错计算系统的设计方法 该提案重点关注开发能够容错硅硬件中中等数量缺陷的计算系统。硅缺陷是硬件部件面临的一个紧迫问题，主要是因为晶体管尺寸缩小到几十纳米。该提案从几个角度实现了这一目标：首先，它开发了一个框架，用于分析与一系列芯片故障相关的影响和暴露风险。在这种情况下，分析的故障类型有： 1）软错误，即由大气中存在的能量粒子引起的瞬态故障，估计这与未来几年的硅技术相关； 2）由于制造小尺寸晶体管部件的不精确性而导致的制造缺陷； 3) 磨损故障，这是由于晶体管接近纳米尺寸时性能减弱造成的。该提案的第二个目标是开发软件来支持对一系列潜在的未来场景（包括这些类型的故障）的分析和评估。最后，该提案的第三个目标是开发两种实验性微处理器设计，探索弹性系统设计领域的两个解决方案点：一种设计可以承受中到高水平的缺陷，而另一种设计可以仅承受第一次故障，但成本和性能影响最小。