Magnetic Self-Assembly of Small Parts

小零件的磁性自组装

• 批准号: 0556056
• 负责人: David Arnold
• 金额: $ 22.6万
• 依托单位: University of Florida
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-05-01 至 2010-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0556056&HistoricalAwards=false
• 关键词: Magnetic; Self; Assembly; Small; Parts

This project aims to overcome the current manufacturing bottlenecks associated with the serial manipulation and assembly of large numbers of small components. High-throughput part manipulation is of great importance for the continued miniaturization of the electronic devices that sustain and propel modern society. The objective of this research is to develop magnetically-directed, self-assembly approaches to enable complex, three-dimensional structures to be formed autonomously from a heterogeneous mixture of parts of arbitrary size and shape. To achieve this, arrays of tiny magnets will be integrated onto the surfaces of batch-fabricated microelectronic components using conventional, low-cost electroplating approaches. Through careful design, the size and number of magnets control the magnetic bonding forces, while the shape and distribution of the magnets form a lock and key pattern-matching mechanism. Thus, different magnetic patterns can be used to direct the assembly of a multiplicity of components in parallel. BROADER IMPACT: Magnetic self-assembly aims to reduce the size and overall cost of existing microelectronic systems and enable the extreme integration of unpackaged CMOS, MEMS, RF, and photonic devices for ultra-compact, multifunctional, hybrid microsystems. The micro-magnetic design, modeling, and fabrication in this project will also cross-pollinate other cutting-edge research areas, such as magnetic MEMS actuators and compact power systems. More broadly, this project will prepare students for engineering in the 21st century by incorporating interdisciplinary design and problem-solving techniques through both educational activities and applied research.

该项目旨在克服目前与大量小部件的串行操作和组装相关的制造瓶颈。 高通量的部件操作对于维持和推动现代社会的电子设备的持续小型化具有重要意义。 本研究的目的是开发磁导向的自组装方法，使复杂的三维结构能够从任意大小和形状的部件的异质混合物中自主形成。 为了实现这一目标，将使用传统的低成本电镀方法将微小磁体阵列集成到批量制造的微电子元件的表面上。 通过精心设计，磁铁的大小和数量控制了磁性结合力，而磁铁的形状和分布形成了锁和钥匙的模式匹配机制。 因此，可以使用不同的磁性图案来引导多个部件的并行组装。 更广泛的影响：磁性自组装旨在减小现有微电子系统的尺寸和总体成本，并实现未封装CMOS、MEMS、RF和光子器件的极端集成，以实现超紧凑、多功能、混合微系统。 该项目中的微磁设计、建模和制造也将交叉影响其他前沿研究领域，如磁性MEMS致动器和紧凑型电源系统。 更广泛地说，该项目将通过教育活动和应用研究，结合跨学科设计和解决问题的技术，为学生在21世纪世纪的工程做好准备。