Integrated DC-DC Converter with Substrate-Molded Filter

具有基板模制滤波器的集成 DC-DC 转换器

• 批准号: 0601294
• 负责人: Huikai Xie
• 金额: $ 24万
• 依托单位: University of Florida
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-05-01 至 2010-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0601294&HistoricalAwards=false
• 关键词: Integrated; DC; Converter; Substrate; Molded

Integrated DC-DC Converter with Substrate-Molded Filter (Proposal No. ECS-0601294)PI: Huikai XieAbstractAbstract: This project investigates a CMOS-compatible micromachining process for building low-loss, high-power density inductors in the substrate of a semiconductor IC chip. By utilizing the substrate as a disposable mold, conductor and core laminates could be made as thick (~200-500mm) as the substrate. The substrate-molded inductors thus formed are combined with the CMOS power electronics on the chip surface to realize an integrated dc-dc converter. A multi-phase buck converter with coupled inductors is employed to alleviate the inductance requirement and to improve transient response. Symmetric core geometries can be realized, eliminating the problems associated with flux imbalance. The magnetic field can be shaped to parallel to, rather than cutting into, the silicon circuitry. Thermal plugs (the inductor windings being some of them) can be embedded to enhance heat removal. Intellectual Merit: Two sets of intellectual merits can be identified with the aforementioned goals. The first set comprises the advances needed to add the third dimension to the popular planar inductor fabrication processes. The second set comprises the opportunities to realize near-ideal magnetic and circuit performance that are not realizable with discrete components. Broader Impact: The success of this project will directly benefit portable electronics markets such as cell phones and laptops because of the small size, low power loss and low cost of the proposed fully integrated power converter. The silicon molding process opens the door for monolithic wireless sensors too. This research topic will be included in a graduate course, Advanced Microsystem Technology, newly developed by the PI. The co-PIs will also participate in the STEP-UP program designed to promote academic and personal success among minority freshman engineering students.

带有衬底模制滤波器的集成DC-DC转换器（提案编号ECS-0601294）PI：Huikai Xie摘要：该项目研究一种CMOS兼容的微加工工艺，用于在半导体IC芯片的衬底中构建低损耗、高功率密度电感器。通过利用基板作为一次性模具，导体和芯层压件可以被制成与基板一样厚（~200- 500 mm）。由此形成的衬底模制电感器与芯片表面上的CMOS功率电子器件相结合，以实现集成的DC-DC转换器。多相降压变换器与耦合电感被用来减轻电感的要求，并改善瞬态响应。可以实现对称的磁芯几何形状，消除与磁通量不平衡相关的问题。磁场可以被成形为平行于硅电路，而不是切入硅电路。可以嵌入热塞（电感器绕组是其中的一部分）以增强散热。智力优点：上述目标可以确定两组智力优点。第一组包括向流行的平面电感器制造工艺添加第三维所需的进步。第二组包括实现接近理想的磁性和电路性能的机会，这些性能是分立元件无法实现的。更广泛的影响：该项目的成功将直接有利于便携式电子市场，如手机和笔记本电脑，因为小尺寸，低功耗和低成本的建议完全集成的电源转换器。硅成型工艺也为单片无线传感器打开了大门。本研究课题将纳入PI新开发的研究生课程“高级微系统技术”。合作PI还将参加旨在促进少数民族大一工程专业学生的学术和个人成功的STEP-UP计划。