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MRI: ACQUISITION OF DEEP REACTIVE ION ETCHING TOOL FOR INTERDISCIPLINARY RESEARCH AT THE UNIVERSITY OF SOUTH FLORIDA

MRI: ACQUISITION OF DEEP REACTIVE ION ETCHING TOOL FOR INTERDISCIPLINARY RESEARCH AT THE UNIVERSITY OF SOUTH FLORIDA
MRI:南佛罗里达大学购买深反应离子蚀刻工具用于跨学科研究
批准号:
0619653
负责人:
Shekhar Bhansali
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2006
资助国家:
美国
项目状态:
已结题
起止时间:
2006-09-15 至 2007-12-31

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中文摘要
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英文摘要
The objective of this research is to augment the MEMS and micro/nanotechnology research programs at the University of South Florida through the acquisition of a Deep Reactive Ion Etching (DRIE) tool (configured for deep silicon, dielectric and SiC etching) and a surface profilometer. The approach is to leverage: (a) on numerous USF research and training awards, (b) an interdisciplinary research culture that has a broad social participation of faculty and students. The instrumentation described in this proposal will provide the impetus to drive research in micro/nanotechnology as well as serve as an educational spring-board for engineers and scientists of tomorrow. Intellectual Merit: The requested instrumentation will be a major addition to the infrastructure of the research center - NNRC and the university. They would embellish the existing assortment of tools at the researchers' disposal. Proposed research will integrate developments in different research areas in a novel approach that will advance the knowledge and understanding in diverse fields, from understanding to sensing. The research tool will provide a basis for fabrication of systems for quantitative diagnosis in diverse environments. Broader Impact: This research will train students in emerging cross-disciplinary areas. The current research activities will have continued participation of undergraduate students and underrepresented groups (minority, women). It is anticipated that over 30 minority students will benefit from the acquisition in the first year. The results of the research will be widely disseminated through inclusion in courses and modules developed by PIs, demonstrations and outreach.
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