GOALI: Integrated Microwave Microneedle-Electrode System For Fine Scale Material and Device Characterization

GOALI：用于精细材料和器件表征的集成微波微针电极系统

• 批准号: 0925968
• 负责人: Shekhar Bhansali
• 金额: --
• 依托单位: University of South Florida
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-08-15 至 2011-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0925968&HistoricalAwards=false
• 关键词: GOALI; Integrated; Microwave; Microneedle; Electrode

The goal of this research is to make possible the accurate mapping of the high-frequency dielectric (or impedance) properties of materials ranging from device wafers and polymeric substrates (in-line process control) to biological materials, such as human skin, at multiple depths on a fine scale. The conductive coaxial needles will be configured on a fixed-grid array and be of lengths varying from ~50-250 microns. The resulting constructs also provide a new technology to affordably produce RF probes with small separations. The reduction of probe costs (from few thousand dollars per probe to few dollars per probe) has the potential to transform RF-test protocols and enable affordable wafer level probing at a fine scale. Local integration of the electronics provides a low-noise measurement solution, but requires significant miniaturization and therefore motivates a transmission line approach with minimum leakage and cross-talk. Intellectual Merit - Existing methods for high-frequency material characterization will be refined in scale and sample density by the proposed microsystem. Unlike current techniques that provide single point measurement in the range of 100's of microns, the proposed MEMS-based approach will enable a large number of measurements (while enabling multi-point sampling via the fixed needle matrix). This research represents a new merging of MEMS and microwave-suitable sensing techniques for impedance measurements. Broader Impacts - The technology addressed in this research will impact several areas of test, measurement and systems design ranging from materials characterization to detection of impurities in wafer scale processing. The probe architectures will be suitable for high frequency metrological characterization of micron-scale devices, such as emerging mm- and sub-mm-wave transistor technologies. The fabrication techniques for producing integrated micro coaxial transmission lines will facilitate the development of 3-D microwave and mm-wave systems for sensing and communications, while simultaneously integrating sensing and packaging functions of the material. Finally, the ability for fine-scale material characterization will aid research in many materials-related areas including nano-particle thin-films, lubricants, fuels and other fluids. The research provides new opportunities for research fellows in our active training programs (Bridge to Doctorate and Alfred P. Sloan Foundation Doctoral Fellowship Program). The research outcomes will also be integrated into a new graduate level sequence at the University of South Florida that forms the core curriculum for our training grants.

这项研究的目标是使高频介电（或阻抗）性能的精确映射的材料范围从设备晶片和聚合物基板（在线过程控制）的生物材料，如人类皮肤，在多个深度上的精细尺度。 导电同轴针将配置在固定网格阵列上，长度在~50-250微米之间变化。 由此产生的结构还提供了一种新的技术，以方便地生产具有小间隔的RF探针。 探针成本的降低（从每个探针几千美元到每个探针几美元）有可能改变RF测试协议，并以精细的规模实现负担得起的晶圆级探测。 电子器件的局部集成提供了低噪声测量解决方案，但需要显著的小型化，因此需要具有最小泄漏和串扰的传输线方法。智力优点-现有的方法，高频材料特性将细化规模和样品密度的拟议微系统。 与提供数百微米范围内的单点测量的当前技术不同，所提出的基于MEMS的方法将实现大量测量（同时通过固定针矩阵实现多点采样）。 这项研究代表了一种新的融合MEMS和微波适用于阻抗测量的传感技术。 更广泛的影响-本研究中涉及的技术将影响测试，测量和系统设计的几个领域，从材料表征到晶圆级加工中的杂质检测。 该探针结构将适用于微米级器件的高频特性表征，例如新兴的毫米波和亚毫米波晶体管技术。 用于生产集成微同轴传输线的制造技术将促进用于传感和通信的3-D微波和毫米波系统的开发，同时集成材料的传感和封装功能。 最后，精细尺度材料表征的能力将有助于许多材料相关领域的研究，包括纳米颗粒薄膜，润滑剂，燃料和其他流体。 这项研究为我们的积极培训计划（博士学位之桥和阿尔弗雷德·斯隆基金会博士奖学金计划）的研究人员提供了新的机会。研究成果也将被整合到一个新的研究生水平序列在南佛罗里达大学，形成我们的培训赠款的核心课程。