Next generation die attach technologies using nanoengineered materials

使用纳米工程材料的下一代芯片贴装技术

• 批准号: 0621722
• 负责人: Vivek Subramanian
• 金额: $ 24万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-08-15 至 2009-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0621722&HistoricalAwards=false
• 关键词: Next; generation; die; attach; technologies

The objective of this research is the development of a novel solder technology for future semiconductor packaging applications. The approach involves the development of fused metallic nanoparticle technology as a "solder" material. This technology will achieve dramatic improvements in electrical performance, reliability, and environmental compatibility over conventional solders by exploiting the low melting temperature of metallic nanoparticles. This in turn should allow the continued scaling and evolution of microelectronics technology. Challenges for conventional solder technology are extreme. Environmental regulations have resulted in a move away from lead-based solders. There has also been a move towards polymer-based packages, placing constraints on peak processing temperatures. Increased chip densities have also resulted in the need for unprecedented I/O pin densities. The novel solder technology pursued in this proposal specifically addresses these needs through efforts in nanoparticle synthesis, development of printable nanoparticle inks for use as solders, and characterization of electrical properties and reliability of nanoparticle solder joins.This proposal is technically important since it will contribute to the development of a viable solder technology for future generations of semiconductor packaging technology. With the continued deployment of low-cost, portable, system-in-package consumer appliances, the need for dramatic improvements in packaging technology are tremendous. Broader impacts of this proposal include mentorship of undergraduates in research, outreach to high-school students to facilitate their retention in science and engineering, and outreach to underrepresented minority groups through recruiting activities at historically black colleges and universities, with the goal of attracting underrepresented minority students into engineering research.

本研究的目的是为未来的半导体封装应用开发一种新的焊料技术。 该方法涉及熔融金属纳米颗粒技术作为“焊料”材料的发展。 该技术将通过利用金属纳米颗粒的低熔化温度，在电气性能、可靠性和环境兼容性方面实现比传统焊料显著的改进。 这反过来又将使微电子技术的持续扩展和发展成为可能。 传统焊接技术面临的挑战是极端的。 环境法规已导致远离铅基焊料。 还有一种趋势是聚合物封装，这对峰值加工温度产生了限制。 芯片密度的增加也导致了对前所未有的I/O引脚密度的需求。 本提案中所追求的新型焊料技术通过在纳米粒子合成、可印刷纳米粒子油墨用作焊料的开发以及纳米粒子焊料连接的电性能和可靠性表征方面的努力来具体解决这些需求，本提案在技术上是重要的，因为它将有助于为未来几代半导体封装技术开发可行的焊料技术。 随着低成本、便携式、系统级封装的消费电器的持续部署，对封装技术的显著改进的需求是巨大的。 这一提议的更广泛影响包括指导本科生进行研究，与高中生进行外联，以促进他们留在科学和工程领域，并通过在历史上的黑人学院和大学开展招聘活动，与代表性不足的少数群体进行外联，目的是吸引代表性不足的少数群体学生参加工程研究。