TCHCS: Hybrid RF/Optical ICs for High-Bandwidth Spread-Spectrum Communications

TCHCS：用于高带宽扩频通信的混合射频/光学 IC

• 批准号: 0636650
• 负责人: Robert McLeod
• 金额: --
• 依托单位: University of Colorado at Boulder
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-01-01 至 2010-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0636650&HistoricalAwards=false
• 关键词: TCHCS; Hybrid; RF; Optical; ICs

ECS-0636650R. McLeod, University of Colorado at BoulderThis new architecture requires an equally novel integration platform for hybrid electro-optic systems. The proposed platform can be thought of as "optical wire-bonding" in which arbitrary discrete RF or optical components are interconnected in 3D to form complex, dense circuits. This process is made possible by advanced photopolymers that can simultaneously encapsulate the individual hybrid subcomponents and can be photo-patterned in 3D to develop micron-scale gradient index features. These index features in the form of optical waveguides are aligned to the encapsulated hybrids by a custom 3D lithography system, avoiding all active alignment. Intellectual MeritThis proposal presents a revolutionary integration technology for RF/optical components in the context of a hybrid wireless/optical communication system. The architecture supports multi-channel, mobile GHz bandwidth without the limitations of traditional spread-spectrum codes or adaptive beam-steered antenna arrays. The cornerstone of the communication architecture is a smart electro-optic node (SEON) that adaptively tracks multiple broadband mobile transmitters. Reception is performed with a small-aperture adaptive array automatically listening on as many channels as it has antenna elements; a scaling which is significantly better than current adaptive beam-forming systems.Broader ImpactsThe proposed hybrid circuits are fabricated on a single, inexpensive lithography station that, similar to rapid-prototyping processes, can fabricate complex single parts with no costly masks using only low-cost monomer. This enables both large economic impact in small production volumes and large-scale undergraduate educational use. The PI's will extend this educational impact via a new graduate course, ECEN 5004, Fundamentals and technology for RF-optical communication systems

ECS-0636650R。McLeod，科罗拉多大学博尔德分校这种新的架构需要一个同样新颖的混合电光系统集成平台。 所提出的平台可以被认为是“光学引线键合”，其中任意离散的RF或光学元件在3D中互连以形成复杂、密集的电路。 先进的光聚合物可以同时封装各个混合子组件，并可以在3D中进行光图案化，以开发微米级梯度折射率特征。 这些光学波导形式的折射率特征通过定制的3D光刻系统与封装的混合物对准，避免了所有主动对准。 智能优势该提案为混合无线/光通信系统中的RF/光组件提供了革命性的集成技术。该架构支持多信道、移动的GHz带宽，而不受传统扩频码或自适应波束控制天线阵列的限制。通信架构的基石是一个智能电光节点（SEON），自适应跟踪多个宽带移动的发射机。 接收与小孔径自适应阵列自动监听尽可能多的通道，因为它有天线元件;缩放，这是显着优于目前的自适应波束形成systems.Broader ImpactsThe建议的混合电路制造在一个单一的，廉价的光刻站，类似于快速原型制作过程，可以制造复杂的单一部件，没有昂贵的掩模，只使用低成本的单体。 这使得在小生产量和大规模的本科教育使用的巨大经济影响。PI将通过一门新的研究生课程ECEN 5004，射频光通信系统的基础和技术来扩展这种教育影响