SBIR Phase I: High Speed Flexible Printed Circuit (FPC)

SBIR 第一阶段：高速柔性印刷电路 (FPC)

• 批准号: 0637277
• 负责人: Achyut Dutta
• 金额: $ 10万
• 依托单位: Banpil Photonics, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-01-01 至 2007-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0637277&HistoricalAwards=false
• 关键词: SBIR; Phase; Speed; Flexible; Printed

The Small Business Innovation Research (SBIR) Phase I Project will investigate an innovative high-speed Flexible Printed Circuit (FPC) utilizing conventional material (like Polyimide) and standard manufacturing process. With the continued growth in integration density of CMOS (complementary metal-oxide semiconductor) technology and clock frequency of chips, the aggregate bandwidth required between future-generation chip and chipsets will increase sharply. Driving serial or parallel data at high speed over conventional flexible board (i.e. flexible) is becoming a severe design constraint in many applications. Today, divding high speed signal into several low speed signals and driving those signals in parallel are common. Utilizing this technique will not fully utilize the chip speed and thereby overall system performance will not be improved siginificantly. The proposed technology will produce the high speed FPC which will have high signal carrying capacity. Utilizing such FPC will help to increase the system performance significantly. The objectives of the project are to identify the best structural configuration and its optimization, to design the polymer-based FPC, and to establish the feasibility of high speed FPC board. In this project, prototypes will be made and evaluated, measurements of relevant characteristics will be conducted, and a development path for the next phase of the project will be identified. The project has the potential to produce the high speed interfaces suitable for next generation digital and RF system applications. The direct commercial potential of the project lies in interface products, manufactured using this technology for HDTV, flat-panel display, networking equipments, imaging and video systems, etc.

小型企业创新研究 (SBIR) 第一阶段项目将研究利用传统材料（如聚酰亚胺）和标准制造工艺的创新高速柔性印刷电路（FPC）。随着CMOS（互补金属氧化物半导体）技术集成度和芯片时钟频率的持续增长，未来一代芯片和芯片组之间所需的总带宽将急剧增加。在传统柔性板（即柔性板）上高速驱动串行或并行数据正在成为许多应用中的严格设计约束。如今，将高速信号分成几个低速信号并并行驱动这些信号是很常见的。采用这种技术并不能充分利用芯片速度，因此整体系统性能不会得到显着提高。 所提出的技术将生产具有高信号承载能力的高速FPC。利用这种FPC将有助于显着提高系统性能。该项目的目标是确定最佳结构配置及其优化，设计基于聚合物的FPC，并建立高速FPC板的可行性。在该项目中，将制作和评估原型，对相关特性进行测量，并确定项目下一阶段的开发路径。该项目有潜力生产适合下一代数字和射频系统应用的高速接口。该项目的直接商业潜力在于使用该技术制造的高清电视、平板显示器、网络设备、成像和视频系统等接口产品。