SBIR Phase I: Innovative High Speed Electrical Chip-to-Chip Interconnects for Next Generation Systems

这个SBIR第一阶段项目提出了芯片到芯片的互连，可以应用于高性能网络系统和/或计算系统的主板/背板，其中每通道（串行）的信号速度需要10gb /s以上。提出了一种具有成本效益的创新型高速（每通道20Gb/s）电互连技术，该技术可使板级互连的信号承载能力比传统技术提高6倍以上。通过使用标准电介质材料，这有助于以更低的成本将信号传输到更远的距离（在给定的信号速度下）。该公司将研究设计、概念的可行性、工艺开发和数据分析方法，以创建一个高速互连PCB板，每个PCB板可以携带高达20 Gb/s的信号。提出的高速电子芯片对芯片互连将应用于高速个人电脑、高速服务器、网络系统、游戏机、通信系统、成像和视频系统。

This SBIR Phase I project proposes chip-to-chip interconnects that can be applied in the mother boards/ backplanes of high performance networking systems and/or computing systems, where 10 Gb/s and beyond signal speed per channel (serial) is necessary. An innovative cost-effective high speed ( 20Gb/s per channel) electrical interconnect technology, which can increase the signal carrying capacity of the board-level interconnects more than 6 times than the conventional technology is proposed. This can help to route the signal longer distances (at given signal-speed) at lower cost by using standard dielectric material. The company will investigate the design, feasibility of the concept, process development, and data analysis approaches in order to create a high speed interconnect PCB board, and each can carry the signal as high as 20 Gb/s.The proposed high speed electrical chip-to-chip interconnects will have applications in high speed PCs, high-speed servers, networking systems, gaming machines, communications systems, imaging and video systems.