SBIR Phase I: Innovative High Speed Electrical Chip-to-Chip Interconnects for Next Generation Systems

这个SBIR一期项目提出了芯片到芯片的互连，可以应用于高性能网络系统和/或计算系统的主板/背板，其中需要10 Gb/S或更高的每通道(串行)信号速度。提出了一种创新的高性价比高速(每通道20 Gb/S)电互连技术，可使板级互连的信号承载能力比传统技术提高6倍以上。这有助于通过使用标准介质材料以较低的成本(在给定的信号速度下)路由更长距离的信号。该公司将研究这一概念的设计、可行性、工艺开发和数据分析方法，以创建一种高速互连PCB板，每个板可以承载高达20 Gb/s的信号。建议的高速电子芯片到芯片互连将应用于高速PC、高速服务器、网络系统、游戏机、通信系统、成像和视频系统。

This SBIR Phase I project proposes chip-to-chip interconnects that can be applied in the mother boards/ backplanes of high performance networking systems and/or computing systems, where 10 Gb/s and beyond signal speed per channel (serial) is necessary. An innovative cost-effective high speed ( 20Gb/s per channel) electrical interconnect technology, which can increase the signal carrying capacity of the board-level interconnects more than 6 times than the conventional technology is proposed. This can help to route the signal longer distances (at given signal-speed) at lower cost by using standard dielectric material. The company will investigate the design, feasibility of the concept, process development, and data analysis approaches in order to create a high speed interconnect PCB board, and each can carry the signal as high as 20 Gb/s.The proposed high speed electrical chip-to-chip interconnects will have applications in high speed PCs, high-speed servers, networking systems, gaming machines, communications systems, imaging and video systems.