Interconnected Molecular Devices with Patterned Polymeric Contact Layers

具有图案化聚合物接触层的互连分子器件。分子器件层的互连对基于分子电子学的电路的实现提出了重大挑战。这项研究的目标是开发策略，通过控制接触层的沉积和图案化来构建高产量互连的聚合物-分子器件结，并设计出将分子器件垂直集成到有用电路中的途径。图案化接触层的方法是通过选择性地在分子器件层上沉积或从没有活性器件层的层中选择性地移除，从而使具有可垂直集成以形成高密度电路的顶部和底部触点的独立可寻址阵列的分子器件成为可能。智力价值：该工作的智力优点包括通过提高器件成品率来实现更好的互连策略；能够对器件结内的化学稳定性、电迁移和分子构象变化进行研究；以及开发与垂直集成兼容的器件结构。由于分子电子学被视为下一代与cmos兼容的纳米电子电路的一种可行的替代方案，互连策略的发展对其的采用至关重要。更广泛的影响：更广泛的教育影响包括了解从稳定的聚合物接触到分子器件层的电子耦合的限制，以及解决分子器件与CMOS电路的信号集成问题。这项工作将支持一名博士生，这项研究的教育内容将被整合到关于纳米电子学、纳米制造和纳米器件表征的远程教育课程中。

Interconnected Molecular Devices with patterned Polymeric Contact LayersN. Swami, L. Harriott, Electrical Engineering, University of Virginia (UVA)The interconnection of molecular device layers presents a major challenge to the realization of circuits based on molecular electronics. The objectives of this research are to develop strategies for the construction of high-yield interconnected polymer-molecular device junctions through controlled deposition and patterning of contact layers, and devise pathways for the vertical integration of molecular devices into useful circuits. The approach to pattern contact layers is through selective deposition on molecular device layers or selective removal from layers without active device layers, thereby enabling molecular devices with independently addressable arrays of top and bottom contacts that may be integrated vertically to form high-density circuits.Intellectual Merit:Intellectual merits of the work include the enabling of better interconnection strategies through the improvement of device yield; the capability to conduct studies on chemical stability, electromigration, and molecular conformation changes within a device junction; and the development of device structures that are compatible with vertical integration. Since molecular electronics is seen as a viable alternative to next-generation CMOS-compatible nanoelectronic circuits, the development of interconnection strategies is crucial to its adoption. Broader Impacts:Broader educational impacts include an understanding of the limits of electronic coupling to molecular device layers from stable polymer contacts, and addressing signal integration of molecular devices with CMOS circuits. One Ph.D. student will be supported for this work, and educational content from this research will be integrated into distance education courses on Nanoelectronics, Nanofabrication and Nano-device characterization.