STTR Phase I: Thermally-Assisted Electro-Etching of Electronics Packages

STTR 第一阶段：电子封装的热辅助电蚀刻

• 批准号: 0711332
• 负责人: Heather McCrabb
• 金额: $ 15万
• 依托单位: FARADAY TECHNOLOGY, INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-07-01 至 2008-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0711332&HistoricalAwards=false
• 关键词: STTR; Phase; Thermally; Assisted; Electro

This Small Business Technology Transfer (STTR) Phase I project addresses an enabling technology for fabrication of printed circuit boards and electronic packages. The demand for increased integrated circuit density, performance and reliability while reducing size, weight and cost of electronic modules requires interconnects and packaging to employ lines and spaces that are less than 75 micron in width. Through-mask chemical etching of interconnects isotropically attacks copper under the mask, limiting feature sizes to larger than 75 micron. The proposed innovation, Thermally-Assisted Electro-Etching, combines Faradayic electrochemical etching to generate an anisotropic current distribution through the mask, with a pulsed thermal source to enhance anisotropic etching by selective heating of the exposed copper. Unlike chemical etching, this technology will enable through-mask etching of features 25 - 30 micron in width. The Phase I project will demonstrate this technology through design and build of an apparatus that promotes controlled etching, electrolyte selection, optimization of electrochemical and thermal process parameters, and an economic evaluation of the technology. The anticipated result is a robust, anisotropic, cost-effective through-mask etching process for electronic packaging features below 75 micron. The project team, Faraday, Columbia University and Lockheed-Martin, will set the stage for technology validation and commercialization.The research project, if successful, will result in higher density, lower cost interconnect applications. The proposed technological innovation is benign and will not adversely impact the environment nor worker safety. Workforce development with Columbia undergraduate and graduate students is anticipated and Faraday routinely provides opportunities for local undergraduate students and high school teachers in conjunction with NSF's REU and RET programs, respectively.

这个小企业技术转让（STTR）第一阶段项目解决了印刷电路板和电子封装制造的使能技术。对增加集成电路密度、性能和可靠性同时减小电子模块的尺寸、重量和成本的需求要求互连和封装采用宽度小于75微米的线和空间。互连的掩模化学蚀刻各向同性地侵蚀掩模下的铜，将特征尺寸限制为大于75微米。提出的创新，热辅助电蚀刻，结合法拉第电化学蚀刻，以产生通过掩模的各向异性电流分布，与脉冲热源，以增强各向异性蚀刻通过选择性加热暴露的铜。与化学蚀刻不同，该技术将能够实现宽度为25 - 30微米的特征的穿透掩模蚀刻。第一阶段项目将通过设计和建造一种促进受控蚀刻、电解质选择、电化学和热工艺参数优化以及技术经济评估的设备来展示该技术。预期的结果是针对75微米以下电子封装特征的稳健、各向异性、具有成本效益的穿透掩模蚀刻工艺。由法拉第、哥伦比亚大学和洛克希德马丁公司组成的项目小组将为技术验证和商业化奠定基础。该研究项目如果成功，将导致更高密度、更低成本的互连应用。 拟议的技术创新是良性的，不会对环境或工人安全产生不利影响。预计哥伦比亚大学本科生和研究生的劳动力发展，法拉第定期为当地本科生和高中教师提供机会，分别与NSF的REU和RET项目合作。