Workshop Support: Workshop on New Research Frontiers in Shape, Solid, and Physical Modeling

2008年6月2日至6日，州立大学纽约州立大学（斯托尼布鲁克大学）将在斯托尼布鲁克举办并共同赞助斯托尼布鲁克建模周。斯托尼布鲁克建模周包括两个连续举行的著名研讨会，即年度固体和物理建模研讨会（将于2008年6月2日至4日举行）和年度形状建模和应用国际会议（将于2008年6月4日至6日举行）。这两个会议中的第一个，ACM Symposium on Solid and Physical Modeling（SPM）是由计算机图形学协会（ACM SIGGRAPH）共同主办的。这是一个一年一度的国际论坛，旨在交流空间建模和计算在设计，分析，仿真和制造中的应用以及新兴的生物医学，地球物理和其他相关领域的最新研究成果。第二次会议，形状建模与应用国际会议（SMI）由电气和电子工程师协会计算机协会（IEEE-CS）共同主办并提供了一个国际论坛的传播新的计算技术的建模和处理数字表示的形状和他们的属性，以不同的社区的专家在广泛的领域。这两个会议传统上分别在2004年和2005年形成了《形状和固体国际公约》。

Workshop on New Research Frontiers in Shape, Solid, and Physical ModelingPI: Hong Qin, SUNY at Stony BrookAbstract:On June 2-6, 2008, State University of New York at Stony Brook (Stony Brook University) will be hostingand co-sponsoring Stony Brook Modeling Week. The Stony Brook Modeling Week comprises twoprestigious symposia that are being held consecutively, namely, the annual Solid and Physical ModelingSymposium (to be held on June 2-4, 2008) and the annual International Conference on Shape Modeling andApplications (to be held on June 4-6, 2008). The first of these two conferences, the ACM Symposium onSolid and Physical Modeling (SPM) is co-sponsored by the Association For Computing Machinery SpecialInterest Group on Computer Graphics (ACM SIGGRAPH). It is an annual international forum for the exchangeof recent research results in applications of spatial modeling and computations in design, analysis,simulation, and manufacturing, as well as in emerging biomedical, geophysical, and other relevant areas.The second conference, the International Conference on Shape Modeling and Applications (SMI) is cosponsoredby the Institute of Electrical and Electronic Engineers Computer Society (IEEE-CS) and providesan international forum for the dissemination of new computational techniques for modeling and processingdigital representations of shapes and their properties to a diverse community of experts across a wide rangeof areas. These two conferences together traditionally had formed the International Convention on Shapesand Solids in 2004 and 2005, respectively.