Workshop Support: Workshop on New Research Frontiers in Shape, Solid, and Physical Modeling

形状、实体和物理模型的新研究前沿研讨会PI：洪钦，纽约州立大学石溪分校摘要：2008年6月2-6日，纽约州立大学石溪分校(石溪大学)将主办并共同赞助石溪模特周。石溪造型周包括两个连续举行的重要研讨会，即一年一度的实体和物理造型研讨会(将于2008年6月2日至4日举行)和一年一度的形状建模与应用国际会议(将于2008年6月4日至6日举行)。这两个会议中的第一个，ACM实体和物理建模研讨会(SPM)是由计算机械协会计算机图形学特别兴趣小组(ACM SIGGRAPH)共同主办的。它是一个年度国际论坛，交流空间建模和计算在设计、分析、模拟和制造以及新兴生物医学、地球物理和其他相关领域的应用方面的最新研究成果。第二次会议，形状建模和应用国际会议(SMI)由电气和电子工程师计算机学会(IEEE-CS)共同主办，并提供一个国际论坛，向范围广泛的不同领域的不同专家社区传播形状及其属性的建模和处理的新计算技术。这两次会议传统上分别在2004年和2005年组成了《关于形状和固体的国际公约》。

Workshop on New Research Frontiers in Shape, Solid, and Physical ModelingPI: Hong Qin, SUNY at Stony BrookAbstract:On June 2-6, 2008, State University of New York at Stony Brook (Stony Brook University) will be hostingand co-sponsoring Stony Brook Modeling Week. The Stony Brook Modeling Week comprises twoprestigious symposia that are being held consecutively, namely, the annual Solid and Physical ModelingSymposium (to be held on June 2-4, 2008) and the annual International Conference on Shape Modeling andApplications (to be held on June 4-6, 2008). The first of these two conferences, the ACM Symposium onSolid and Physical Modeling (SPM) is co-sponsored by the Association For Computing Machinery SpecialInterest Group on Computer Graphics (ACM SIGGRAPH). It is an annual international forum for the exchangeof recent research results in applications of spatial modeling and computations in design, analysis,simulation, and manufacturing, as well as in emerging biomedical, geophysical, and other relevant areas.The second conference, the International Conference on Shape Modeling and Applications (SMI) is cosponsoredby the Institute of Electrical and Electronic Engineers Computer Society (IEEE-CS) and providesan international forum for the dissemination of new computational techniques for modeling and processingdigital representations of shapes and their properties to a diverse community of experts across a wide rangeof areas. These two conferences together traditionally had formed the International Convention on Shapesand Solids in 2004 and 2005, respectively.