SBIR Phase I: CMP Slurry Monitor

SBIR 第一阶段：CMP 浆料监控器

• 批准号: 0740982
• 负责人: Hang Ji
• 金额: --
• 依托单位: Uncopiers, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-01-01 至 2008-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0740982&HistoricalAwards=false
• 关键词: SBIR; Phase; CMP; Slurry; Monitor

This SBIR Phase I project is to develop a Chemical Mechanical Polishing (CMP) Slurry Monitor as a fully in-line, real-time, point of use instrument that will detect and disperse large agglomerates in the nanofine slurries used in IC manufacture. The monitor will not only detect scratch inducing agglomerates but will also attempt to destroy them.Successful development of the slurry monitor will improve yields and decrease costs for the semiconductor industry. The principles of induced microcavitation may find wide applications in liquid/particle processing. By detecting and destroying agglomerates improved processes and products will be enabled.

该SBIR第一阶段项目是开发一种化学机械抛光（CMP）浆料监测器，作为一种完全在线的实时使用点仪器，将检测和分散IC制造中使用的纳米浆料中的大团聚体。 该监控器不仅可以检测到划痕诱导团聚体，还可以尝试破坏它们。浆料监控器的成功开发将提高半导体行业的产量并降低成本。 诱导微空化的原理在液体/颗粒处理中有着广泛的应用。 通过检测和破坏团聚物，将能够改进工艺和产品。